SCHEMBL3149925

SCHEMBL3149925

C/C(=C/C(C)(C)c1ccc(N)cc1)c1ccc(N)cc1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ CYP19A1 P11511 3/20 0.41
▸ EPHX2 P34913 1/20 0.38
▸ PTGS1 P23219 4/20 0.38
▸ NQO2 P16083 1/20 0.38
▸ PTGS2 P35354 1/20 0.38
▸ NPC1 O15118 2/20 0.37
▸ MAPT P10636 2/20 0.37
▸ RAB9A P51151 2/20 0.37
▸ ALDH1A1 P00352 1/20 0.37
▸ HPGD P15428 1/20 0.37
▸ MAPK1 P28482 1/20 0.37
▸ ESRRG P62508 1/20 0.36
▸ ESR1 P03372 2/20 0.36
▸ ESR2 Q92731 2/20 0.36
▸ NR4A1 P22736 1/20 0.36
▸ NR4A2 P43354 1/20 0.36
▸ NR4A3 Q92570 1/20 0.36
▸ MASP2 O00187 1/20 0.34
▸ PLAU P00749 1/20 0.34
▸ THPO P40225 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3149927 1.00 CYP19A1 (0.41) CYP19A1EPHX2PTGS1NQO2PTGS2
SCHEMBL3421062 0.82 PTGS1 (0.54) PTGS1NQO2PTGS2MAPTALDH1A1
SCHEMBL18634918 0.82 PTGS1 (0.54) PTGS1NQO2PTGS2MAPTALDH1A1
SCHEMBL7628787 0.82 PTGS1 (0.54) PTGS1NQO2PTGS2MAPTALDH1A1
SCHEMBL11147182 0.82 TSHR (0.43) PTGS1NQO2PTGS2NPC1MAPT
SCHEMBL3442786 0.76 KDM1A (0.39) MAPTALDH1A1MAPK1ESRRGESR1
SCHEMBL3442788 0.76 KDM1A (0.39) MAPTALDH1A1MAPK1ESRRGESR1
SCHEMBL2989490 0.74 KDM1A (0.38) MAPTALDH1A1MAPK1ESRRGESR1
SCHEMBL11725109 0.74 ELANE (0.49) NPC1MAPTRAB9AESR1MEN1
SCHEMBL31033328 0.74 EPHX2 (0.34) CYP19A1EPHX2PTGS1NPC1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 83 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250110406-A1 METHOD OF PRODUCING RESIST COMPOSITION PURIFIED PRODUCT, RESIST PATTERN FORMING METHOD, AND RESIST COMPOSITION PURIFIED PRODUCT TOKYO OHKA KOGYO CO LTD (JP) 2025-04-03 — — US disclosed
US-20250050269-A1 GAS SEPARATION MEMBRANE, GAS SEPARATION MEMBRANE MODULE, AND GAS PERMEABLE APPARATUS HITACHI GE VERNOVA NUCLEAR ENERGY, LTD. (JP) 2025-02-13 — — US disclosed
US-12186715-B2 Production method for resist composition purified product, resist pattern forming method, and resist composition purified product TOKYO OHKA KOGYO CO., LTD. (JP) 2025-01-07 — — US disclosed
US-20240329525-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-10-03 — — US disclosed
US-20240270919-A1 COMPOSITION FOR PRODUCING POROUS FILM, METHOD FOR PRODUCING POROUS FILM, AND POROUS FILM TOKYO OHKA KOGYO CO., LTD. (JP) 2024-08-15 — — US disclosed
US-20240210827-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-06-27 — — US disclosed
WO-2024062988-A1 RESIN FILM, SCRIBING DEVICE, AND SCRIBING METHOD 三星ダイヤモンド工業株式会社 2024-03-28 — — WO disclosed
US-20240100482-A1 FILTERING DEVICE, PURIFICATION DEVICE, AND METHOD FOR MANUFACTURING CHEMICAL LIQUID FUJIFILM CORPORATION (JP) 2024-03-28 — — US disclosed
US-20240084091-A1 POROUS FILM TOKYO OHKA KOGYO CO., LTD. (JP) 2024-03-14 — — US disclosed
EP-4327919-A1 POROUS FILM TOKYO OHKA KOGYO CO., LTD. (JP) 2024-02-28 — — EP disclosed
EP-1906246-A2 Photosensitive resin composition, production method of cured relief pattern using the same and semiconductor device FUJIFILM Corporation (JP) 2008-04-02 — — EP disclosed
US-5756254-A CONTAINING PHOTOSENSITIVE ACID GENERATOR KABUSHIKI KAISHA TOSHIBA (JP) 1998-05-26 — — US disclosed
US-5753407-A Polyamic acid composition KABUSHIKI KAISHA TOSHIBA (JP) 1998-05-19 — — US disclosed
US-5585217-A Polyamic acid composition KABUSHIKI KAISHA TOSHIBA (JP) 1996-12-17 — — US disclosed
US-5518864-A PHOTOSENSITIVE, QUINONE DIAZIDE KABUSHIKI KAISHA TOSHIBA (JP) 1996-05-21 — — US disclosed
EP-0431971-B1 Photosensitive composition and resin-encapsulated semiconductor device TOSHIBA KK (JP) 1995-07-19 — — EP disclosed
EP-0431971-A2 Photosensitive composition and resin-encapsulated semiconductor device KABUSHIKI KAISHA TOSHIBA (JP) 1991-06-12 — — EP disclosed
US-4500719-A Process for the preparation of N-alkenylphenylmaleimides and N,N'-[alkenylenephenylene]bismalemides MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1985-02-19 — — US disclosed
US-4376206-A QUICK-CURABLE HEAT RESISTANT RESINS MITSUI TOATSU CHEMICALS, INC. (JP) 1983-03-08 — — US disclosed
US-4323662-A Thermosetting resin compositions comprising bismaleimides and alkenylaniline derivatives MITSUI TOATSU CHEMICALS, INC. (JP) 1982-04-06 — — US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12186715-B2 Production method for resist composition purified product, resist pattern forming method, and resist composition purified product PUF60, RIOK2, SLC11A2 CYP19A1 4377/4885EPHX2 2845/4885PTGS1 2455/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.

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