Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.40 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.40 |
| ▸ | AHR | P35869 | 1/20 | 0.36 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.36 |
| ▸ | GRM5 | P41594 | 2/20 | 0.36 |
| ▸ | GAA | P10253 | 2/20 | 0.34 |
| ▸ | KCNH2 | Q12809 | 2/20 | 0.34 |
| ▸ | SLC22A2 | O15244 | 1/20 | 0.34 |
| ▸ | SLC22A1 | O15245 | 1/20 | 0.34 |
| ▸ | PGR | P06401 | 1/20 | 0.34 |
| ▸ | THRB | P10828 | 1/20 | 0.34 |
| ▸ | ADRB3 | P13945 | 1/20 | 0.34 |
| ▸ | OPRK1 | P41145 | 1/20 | 0.34 |
| ▸ | BLM | P54132 | 1/20 | 0.34 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.34 |
| ▸ | PDE3A | Q14432 | 1/20 | 0.34 |
| ▸ | SLC47A1 | Q96FL8 | 1/20 | 0.34 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.34 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.34 |
| ▸ | TSHR | P16473 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL329707 | 0.84 | SMN1; SMN2 (0.38) | SMN1; SMN2L3MBTL1AHRCHRM2GRM5 | |
| SCHEMBL3150669 | 0.83 | SMN1; SMN2 (0.42) | SMN1; SMN2L3MBTL1AHRCHRM2GAA | |
| SCHEMBL21742278 | 0.75 | SMN1; SMN2 (0.41) | SMN1; SMN2L3MBTL1AHRCHRM2GRM5 | |
| SCHEMBL17976212 | 0.74 | SMN1; SMN2 (0.48) | SMN1; SMN2L3MBTL1AHRCHRM2GRM5 | |
| SCHEMBL21742096 | 0.73 | SMN1; SMN2 (0.40) | SMN1; SMN2L3MBTL1AHRCHRM2GRM5 | |
| SCHEMBL27970659 | 0.73 | SMN1; SMN2 (0.37) | SMN1; SMN2L3MBTL1AHRCHRM2GRM5 | |
| SCHEMBL19222207 | 0.73 | SMN1; SMN2 (0.47) | SMN1; SMN2L3MBTL1AHRCHRM2GRM5 | |
| SCHEMBL21742259 | 0.72 | SMN1; SMN2 (0.39) | SMN1; SMN2L3MBTL1AHRCHRM2GAA | |
| SCHEMBL21742092 | 0.72 | SMN1; SMN2 (0.45) | SMN1; SMN2L3MBTL1AHRCHRM2GRM5 | |
| SCHEMBL329680 | 0.71 | SMN1; SMN2 (0.41) | SMN1; SMN2L3MBTL1AHRCHRM2GAA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2026100338-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-09 | — | — | US | disclosed |
| US-12504688-B2 | Negative photosensitive resin composition and method for manufacturing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-23 | — | — | US | disclosed |
| US-20250370339-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-04 | — | — | US | disclosed |
| US-20250341778-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING POLYIMIDE AND CURED RELIEF PATTERN USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-11-06 | — | — | US | disclosed |
| US-12386259-B2 | Negative-type photosensitive resin composition and method for producing polyimide and cured relief pattern using same | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-08-12 | — | — | US | disclosed |
| WO-2024225072-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR CURED RELIEF PATTERN, AND CURED FILM | 旭化成株式会社 | 2024-10-31 | — | — | WO | disclosed |
| WO-2024210063-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, CURED FILM, AND SEMICONDUCTOR DEVICE | 旭化成株式会社 | 2024-10-10 | — | — | WO | disclosed |
| US-20240329525-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-10-03 | — | — | US | disclosed |
| US-20200409263-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-12-31 | — | — | US | disclosed |
| US-10831101-B2 | Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-11-10 | — | — | US | disclosed |
| US-20190113845-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2019-04-18 | — | — | US | disclosed |
| US-20180373147-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2018-12-27 | — | — | US | disclosed |
| US-20170102613-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING HARDENED RELIEF PATTERN, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2017-04-13 | — | — | US | disclosed |
| US-9575410-B2 | Photosensitive resin composition, method for producing hardened relief pattern, semiconductor device and display device | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2017-02-21 | — | — | US | disclosed |
| US-20140349222-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING HARDENED RELIEF PATTERN, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2014-11-27 | — | — | US | disclosed |
| US-7687208-B2 | Positive photosensitive resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2010-03-30 | — | — | US | disclosed |
| US-20090202794-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | ASAHI KASEI EMD CORPORATION (JP) | 2009-08-13 | — | — | US | disclosed |
| EP-2056163-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | Asahi Kasei EMD Corporation (JP) | 2009-05-06 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ARCN1, GLRA1, PSMA1 | SMN1; SMN2 1441/4885L3MBTL1 2733/4885AHR 3995/4885 |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | CD79B, ITGA1, PTK2 | SMN1; SMN2 2936/4885L3MBTL1 2590/4885AHR 3949/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.