SCHEMBL329707

SCHEMBL329707

CCOC([SiH3])C(OCC)(OCC)c1ccccn1

nearest known ligand 0.38

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 2/20 0.38
L3MBTL1 Q9Y468 1/20 0.38
AHR P35869 2/20 0.35
CHRM2 P08172 1/20 0.35
HDAC6 Q9UBN7 2/20 0.32
MEN1 O00255 1/20 0.32
GAA P10253 1/20 0.32
KMT2A Q03164 1/20 0.32
GRM5 P41594 1/20 0.31
ALDH1A1 P00352 1/20 0.31
CYP1A2 P05177 1/20 0.31
KCNA5 P22460 1/20 0.31
KCNH2 Q12809 1/20 0.31
CHRM3 P20309 1/20 0.31
KDM4E B2RXH2 1/20 0.31
CASP1 P29466 1/20 0.31
HSD17B10 Q99714 1/20 0.31
LMNA P02545 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3154258 0.84 SMN1; SMN2 (0.40) SMN1; SMN2L3MBTL1AHRCHRM2HDAC6
SCHEMBL307119 0.78 L3MBTL1 (0.33) L3MBTL1
SCHEMBL329528 0.77 KMT2A (0.30) KMT2A
SCHEMBL8043313 0.77 L3MBTL1 (0.36) L3MBTL1ALDH1A1LMNA
SCHEMBL3929046 0.75 SMN1; SMN2 (0.38) SMN1; SMN2L3MBTL1AHRCHRM2HDAC6
SCHEMBL574402 0.74
SCHEMBL5586177 0.74 L3MBTL1 (0.31) L3MBTL1
SCHEMBL27970659 0.74 SMN1; SMN2 (0.37) SMN1; SMN2L3MBTL1AHRCHRM2HDAC6
SCHEMBL27827267 0.73 SMN1; SMN2 (0.39) SMN1; SMN2L3MBTL1AHRCHRM2MEN1
SCHEMBL574685 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 128 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7528199-B2 Conjugated-diolefin (co)polymer rubber and process for producing the same JSR CORPORATION (JP) 2009-05-05 US claimed
WO-2026100338-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN 旭化成株式会社 2026-05-15 WO disclosed
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-28 US disclosed
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-09 US disclosed
US-12504688-B2 Negative photosensitive resin composition and method for manufacturing cured relief pattern ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-12-23 US disclosed
US-20250370339-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-12-04 US disclosed
US-12415907-B2 Rubber composition and run-flat tire BRIDGESTONE CORPORATION (JP) 2025-09-16 US disclosed
EP-3640291-B1 VULCANIZED RUBBER, TIRE, AND RUN-FLAT TIRE BRIDGESTONE CORP (JP) 2025-02-26 EP disclosed
EP-3640292-B1 SIDE-REINFORCING RUBBER FOR RUN-FLAT TIRE AND RUN-FLAT TIRE BRIDGESTONE CORP (JP) 2025-01-22 EP disclosed
WO-2024225072-A1 PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR CURED RELIEF PATTERN, AND CURED FILM 旭化成株式会社 2024-10-31 WO disclosed
US-7288594-B2 Reacting an organolithium-modified polymer with a silicon compound such as N-(3-triethoxysilylpropyl)-4,5-dihydroimidazole; silica or carbon black-blended rubber for pneumatic tires; tensile strength, abrasion resistance and has low heat buildup property BRIDGESTONE CORPORATION (JP) 2007-10-30 US disclosed
EP-1505087-B1 PROCESS FOR PRODUCING MODIFIED POLYMER, MODIFIED POLYMER OBTAINED BY THE PROCESS, AND RUBBER COMPOSITION BRIDGESTONE CORP (JP) 2007-07-11 EP disclosed
US-20070088132-A1 Conjugated-diolefin (co)polymer rubber and process for producing the same JSR CORPORATION (JP) 2007-04-19 US disclosed
EP-1726598-A1 CONJUGATED-DIOLEFIN (CO)POLYMER RUBBER AND PROCESS FOR PRODUCING THE SAME JSR Corporation (JP) 2006-11-29 EP disclosed
US-20050159554-A1 Process for producing modified polymer, modified polymer obtained by the process, and rubber composition BRIDGESTONE CORPORATION (JP) 2005-07-21 US disclosed
US-20050070672-A1 Conjugated diene polymer, process for its production and rubber compositions containing the same BRIDGESTONE CORPORATION (JP) 2005-03-31 US disclosed
EP-1505087-A1 PROCESS FOR PRODUCING MODIFIED POLYMER, MODIFIED POLYMER OBTAINED BY THE PROCESS, AND RUBBER COMPOSITION Bridgestone Corporation (JP) 2005-02-09 EP disclosed
US-20050020757-A1 Process for producing modified polymer modified polymer obtained by the process and rubber composition BRIDGESTONE CORPORATION (JP) 2005-01-27 US disclosed
EP-1462459-A1 PROCESS FOR PRODUCING MODIFIED POLYMER, MODIFIED POLYMER OBTAINED BY THE PROCESS, AND RUBBER COMPOSITION Bridgestone Corporation (JP) 2004-09-29 EP disclosed
EP-1449857-A1 CONJUGATED DIENE POLYMER, PROCESS FOR ITS PRODUCTION AND RUBBER COMPOSITIONS CONTAINING THE SAME Bridgestone Corporation (JP) 2004-08-25 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12613465-B2 Photosensitive resin composition and method for producing cured relief pattern ARCN1, GLRA1, PSMA1 SMN1; SMN2 1441/4885L3MBTL1 2733/4885AHR 3995/4885
US-20260099093-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME CD79B, ITGA1, PTK2 SMN1; SMN2 2936/4885L3MBTL1 2590/4885AHR 3949/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.