SCHEMBL3154657

SCHEMBL3154657

CC1(CC2CC34OC3(CC2C(=O)O)O4)CCCCC1

nearest known ligand 0.32

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
POLB P06746 1/20 0.32
TSHR P16473 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL466214 0.84
SCHEMBL9067263 0.74
SCHEMBL28192958 0.73 GABRR1 (0.33)
SCHEMBL8401953 0.69 EPHX1 (0.32) POLBTSHR
SCHEMBL475699 0.68
SCHEMBL17626918 0.66
SCHEMBL8758833 0.66
SCHEMBL9378516 0.63
SCHEMBL10355102 0.63
SCHEMBL1857557 0.61 HSD11B1 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1527147-B1 TWO PART EPOXIDE ADHESIVE WITH IMPROVED STRENGTH HENKEL AG & CO KGAA (DE) 2010-03-10 EP claimed
EP-1816175-B1 Thermal interface material HENKEL AG & CO KGAA (DE) 2009-10-14 EP claimed
EP-1818351-B1 Underfill encapsulant for wafer packaging and method for its application HENKEL AG & CO KGAA (DE) 2009-06-24 EP claimed
EP-1470176-B1 NO FLOW UNDERFILL COMPOSITION NAT STARCH CHEM INVEST (US) 2007-06-27 EP claimed
EP-1558678-B1 TOUGHENED EPOXY / POLYANHYDRIDE NO- FLOW UNDERFILL ENCAPSULANT COMPOSITION NAT STARCH CHEM INVEST (US) 2006-09-20 EP claimed
US-9886110-B2 Transparent electroconductive laminate TEIJIN LIMITED (JP) 2018-02-06 US disclosed
US-20150055033-A1 TRANSPARENT ELECTROCONDUCTIVE LAMINATE TEIJIN LIMITED, (JP) 2015-02-26 US disclosed