SCHEMBL315978

SCHEMBL315978

O=C(O)C=CC(C=CC(=O)O)(C=CC(=O)O)C(C=CC(=O)O)(CO)C(CO)(CO)CO

nearest known ligand 0.33

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.33
TP53 P04637 1/20 0.33
EGLN1 Q9GZT9 1/20 0.33
EGLN3 Q9H6Z9 1/20 0.33
GABRR1 P24046 2/20 0.30
GABRR2 P28476 2/20 0.30
BLM P54132 2/20 0.30
GABRR3 A8MPY1 1/20 0.30
LMNA P02545 1/20 0.30
APEX1 P27695 1/20 0.30
NPSR1 Q6W5P4 1/20 0.30
TDP1 Q9NUW8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL154825 0.84 TSHR (0.38) TSHRTP53EGLN1EGLN3GABRR1
SCHEMBL17451338 0.78 TSHR (0.33) TSHRTP53EGLN1EGLN3GABRR1
SCHEMBL119386 0.77 TSHR (0.32) TSHRTP53EGLN1EGLN3
SCHEMBL9627725 0.75 TSHR (0.31) TSHRTP53EGLN1EGLN3
Acrylic Acid SCHEMBL6123355 0.72 LMNA (0.37) LMNA
SCHEMBL8040717 0.71 TSHR (0.35) TSHRTP53EGLN1EGLN3GABRR1
SCHEMBL9346200 0.71
SCHEMBL18173557 0.70 TSHR (0.33) TSHRTP53EGLN1EGLN3GABRR1
SCHEMBL1421018 0.69
SCHEMBL9178471 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2001917-B1 SOLID POLYMERIC ELECTROLYTES BASED ON TRIBLOCK COPOLYMERS, IN PARTICULAR POLYSTYRENE-POLY(OXYETHYLENE)-POLYSTYRENE COPOLYMERS ARKEMA FRANCE (FR) 2014-07-02 EP claimed
EP-0720053-B1 Photosensitive resin composition, photosensitive printing plate and method of manufacturing printing master plate TOKYO OHKA KOGYO CO LTD (JP) 2002-09-04 EP claimed
US-5858540-A CROSSLINKABLE COMPOSITION CONSISTING OF TERPOLYMER HAVING UNITS OF HEXAFLUOROPROPYLENE, TETRAFLUOROETHYLENE AND VINYLIDENE FLUORIDE, MULTIFUNCTIONAL MONOMER HAVING TWO OR MORE UNSATURATED BONDS; HEAT SETTABLE, HEAT SHRINKABLE SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) 1999-01-12 US claimed
EP-0283990-B1 A heat-resistant photosensitive resin composition TOKYO OHKA KOGYO CO LTD (JP) 1994-01-26 EP claimed
WO-2021014956-A1 PHOTOSENSITIVE RESIN COMPOSITION 日産化学株式会社 2021-01-28 WO disclosed
US-10816900-B2 Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-10-27 US disclosed
WO-2020044918-A1 NEGATIVE-WORKING PHOTOSENSITIVE RESIN COMPOSITION 日産化学株式会社 2020-03-05 WO disclosed
US-10203601-B2 Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-02-12 US disclosed
US-20190018320-A1 TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-01-17 US disclosed
US-20180120702-A1 TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-05-03 US disclosed
EP-3315504-A1 TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM Shin-Etsu Chemical Co., Ltd. (JP) 2018-05-02 EP disclosed
US-8865110-B2 Method for producing graphite film and graphite film produced by the method KANEKA CORPORATION (JP) 2014-10-21 US disclosed
US-20100001641-A1 SUBSTRATE STRUCTURE FOR PLASMA DISPLAY PANEL, METHOD OF MANUFACTURING THE SUBSTRATE STRUCTURE, AND PLASMA DISPLAY PANEL INCLUDING THE SUBSTRATE STRUCTURE SAMSUNG SDI CO., LTD. (KR) 2010-01-07 US disclosed
US-20100001640-A1 PASTE CONTAINING ALUMINUM FOR PREPARING PDP ELECTRODE, METHOD OF PREPARING THE PDP ELECTRODE USING THE PASTE AND PDP ELECTRODE PREPARED USING THE METHOD SAMSUNG SDI CO., LTD. (KR) 2010-01-07 US disclosed
US-20080067938-A1 ELECTRODE-FORMING COMPOSITION AND PLASMA DISPLAY PANEL MANUFACTURED USING THE SAME SAMSUNG SDI CO., LTD. (KR) 2008-03-20 US disclosed
EP-1901331-A2 Electrode-Forming Composition and Plasma Display Panel Manufactured Using the Same Samsung SDI Co., Ltd. (KR) 2008-03-19 EP disclosed
US-20080050305-A1 Method for Producing Graphite Film, and Graphite Film Produced By the Method KANEKA CORPORATION (JP) 2008-02-28 US disclosed
US-20060166113-A1 Photosensitive paste composition and plasma display panel manufactured using the same SAMSUNG SDI CO., LTD. (KR) 2006-07-27 US disclosed
US-20060164011-A1 Photosensitive paste composition, PDP electrode manufactured using the composition, and PDP including the PDP electrode SAMSUNG SDI CO., LTD., A CORPORATION OF THE REPUBLIC OF KOREA (KR) 2006-07-27 US disclosed
US-20050271979-A1 Photosensitive paste composition, PDP electrode prepared therefrom, and PDP comprising the PDP electrode SAMSUNG SDI CO., LTD. (KR) 2005-12-08 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20190018320-A1 TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM TET1, KDM2B, ARCN1 TSHR 4134/4885TP53 4350/4885EGLN1 1232/4885
US-10816900-B2 Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film TET1, KDM2B, ARCN1 TSHR 4134/4885TP53 4350/4885EGLN1 1232/4885
US-20180120702-A1 TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM TET1, KDM1A, KDM2B TSHR 3618/4885TP53 4301/4885EGLN1 1166/4885
US-10203601-B2 Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film TET1, KDM1A, KDM2B TSHR 3618/4885TP53 4301/4885EGLN1 1166/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.