SCHEMBL31599166

SCHEMBL31599166

C#CC(=O)c1ccc(Oc2ccc(Oc3ccc(C(=O)C#C)cc3)cc2)cc1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PARP10 Q53GL7 9/20 0.52
PARP15 Q460N3 4/20 0.52
HPGD P15428 3/20 0.52
ALDH1A1 P00352 2/20 0.52
PARP14 Q460N5 2/20 0.52
KMT2A Q03164 1/20 0.52
PARP16 Q8N5Y8 1/20 0.52
PARP11 Q9NR21 1/20 0.52
PARP4 Q9UKK3 1/20 0.52
MAPT P10636 1/20 0.52
RAB9A P51151 1/20 0.52
SMN1; SMN2 Q16637 2/20 0.47
TSHR P16473 1/20 0.47
HTT P42858 1/20 0.47
PARP3 Q9Y6F1 1/20 0.46
PARP2 Q9UGN5 2/20 0.44
SRD5A2 P31213 3/20 0.44
F2 P00734 1/20 0.41
PLAU P00749 1/20 0.41
ST14 Q9Y5Y6 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31599167 1.00 PARP10 (0.52) PARP10PARP15HPGDALDH1A1PARP14
SCHEMBL20565887 0.92 PARP10 (0.58) PARP10ALDH1A1RAB9ASMN1; SMN2TSHR
SCHEMBL31599169 0.86 PARP10 (0.47) PARP10PARP15HPGDALDH1A1PARP14
SCHEMBL31599174 0.86 PARP10 (0.58) PARP10PARP15PARP14RAB9APARP2
SCHEMBL9776467 0.85 TSHR (0.40) HPGDALDH1A1MAPTTSHRHTT
SCHEMBL2122823 0.83 CES2 (0.59) PARP10KMT2APARP4MAPTRAB9A
SCHEMBL12045721 0.81 L3MBTL1 (0.41) PARP10ALDH1A1MAPT
SCHEMBL851386 0.81 MAPT (0.53) PARP10ALDH1A1MAPTRAB9ATSHR
SCHEMBL17237128 0.78 EPHX2 (0.49) RAB9A
SCHEMBL841269 0.78 GAA (0.59) TSHRHTTF2PLAUST14

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025110215-A1 CURABLE COMPOSITION, COMPOUND, HEAT-RESISTANT RESIN MATERIAL, ADHESIVE, SEALING MATERIAL, POTTING AGENT, ENCAPSULANT, CARBON MATERIAL, AND PREPREG セメダイン株式会社 2025-05-30 WO disclosed