SCHEMBL31634582

SCHEMBL31634582

O=C1OC(=O)c2c(-c3cccs3)ccc(-c3cccs3)c21

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ MAOB P27338 4/20 0.45
▸ MAOA P21397 1/20 0.44
▸ LTK P29376 1/20 0.42
▸ CDK5 Q00535 1/20 0.42
▸ MST1R Q04912 1/20 0.42
▸ DYRK1A Q13627 1/20 0.42
▸ CLK4 Q9HAZ1 1/20 0.42
▸ TDO2 P48775 1/20 0.42
▸ ADORA2A P29274 3/20 0.41
▸ ADORA1 P30542 3/20 0.41
▸ TMIGD3 P0DMS9 2/20 0.41
▸ KDM4E B2RXH2 5/20 0.41
▸ HSD17B10 Q99714 3/20 0.41
▸ ALDH1A1 P00352 3/20 0.41
▸ CASP1 P29466 1/20 0.41
▸ SMN1; SMN2 Q16637 1/20 0.41
▸ PGR P06401 1/20 0.40
▸ MAPT P10636 3/20 0.40
▸ TYMP P19971 1/20 0.40
▸ HPGD P15428 2/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23611215 0.86 LTK (0.46) MAOBMAOALTKCDK5MST1R
SCHEMBL16489160 0.80 MAOB (0.43) MAOBMAOALTKCDK5MST1R
SCHEMBL10745113 0.76 PGR (0.43) MAOBMAOALTKCDK5MST1R
SCHEMBL27961703 0.75 LTK (0.50) MAOBMAOALTKCDK5MST1R
SCHEMBL12019932 0.75 MAOB (0.41) MAOBMAOALTKCDK5MST1R
SCHEMBL27988731 0.73 ALDH1A1 (0.50) MAOBMAOALTKCDK5MST1R
SCHEMBL7450150 0.73 KDM4E (0.48) MAOBLTKCDK5MST1RDYRK1A
SCHEMBL20414676 0.72 KDM4E (0.40) ADORA2AADORA1KDM4EHSD17B10ALDH1A1
SCHEMBL28680527 0.72 CHEK1 (0.47) MAOBMAOALTKCDK5MST1R
SCHEMBL18170821 0.71 CHEK1 (0.46) MAOBMAOALTKCDK5MST1R

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120202243-A Thermosetting resin composition, cured film, substrate, and electronic component 捷恩智株式会社 2025-06-24 — — CN disclosed
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