SCHEMBL3175194

SCHEMBL3175194

Brc1c(Br)c(Br)c(OOc2c(Br)c(Br)c(Br)c(Br)c2OOc2c(Br)c(Br)c(Br)c(Br)c2Br)c(Br)c1Br

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2881130 0.80
SCHEMBL11335614 0.72
SCHEMBL10338803 0.70 PTPN1 (0.35)
SCHEMBL437021 0.70 PTPN1 (0.35)
SCHEMBL211401 0.67 PTPN1 (0.33)
SCHEMBL10455206 0.67 PTPN1 (0.33)
Perbromobenzene SCHEMBL27124 0.65 ALDH1A1 (0.50)
SCHEMBL11103320 0.64 CA2 (0.52)
SCHEMBL17910254 0.64 CA2 (0.60)
SCHEMBL11640450 0.62 CA1 (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1391414-B1 DOOR INSTALLED AT PLATFORM FOR ELEVATOR MITSUBISHI ELECTRIC CORP (JP) 2010-03-31 EP disclosed
EP-1258518-B1 Flame-retardant curable resin composition and flame-retardant curable adhesive composition DENKI KAGAKU KOGYO KK (JP) 2006-01-04 EP disclosed
US-6893583-B2 Flame-retardant curable resin composition and flame-retardant curable adhesive composition DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 2005-05-17 US disclosed
EP-1391414-A1 DOOR INSTALLED AT PLATFORM FOR ELEVATOR MITSUBISHI DENKI KABUSHIKI KAISHA (JP) 2004-02-25 EP disclosed
US-20020193487-A1 Flame-retardant curable resin composition and flame-retardant curable adhesive composition DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 2002-12-19 US disclosed
EP-1258518-A2 Flame-retardant curable resin composition and flame-retardant curable adhesive composition DENKI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 2002-11-20 EP disclosed
US-6384128-B1 FLAME RETARDANT THERMOPLASTIC RESIN COMPOSITION WHICH COMPRISES ELECTRICALLY CONDUCTIVE FIBER, THERMOPLASTIC RESIN, AND CARBON POWDER HAVING SPECIFIED RAMAN SCATTERING INTENSITY TORAY INDUSTRIES, INC. (JP) 2002-05-07 US disclosed