SCHEMBL31752

SCHEMBL31752

COC(=O)C(C)(CC(C)(C)C)C(C)(C)C

nearest known ligand 0.38

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
DGAT1 O75907 1/20 0.38
TSHR P16473 2/20 0.33
HSD17B10 Q99714 1/20 0.33
KCNN4 O15554 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15835198 0.82 DGAT1 (0.35) DGAT1TSHRHSD17B10
SCHEMBL23709462 0.82 TSHR (0.36) DGAT1TSHRHSD17B10
SCHEMBL18432078 0.82 DGAT1 (0.35) DGAT1TSHRHSD17B10
SCHEMBL24839012 0.82
SCHEMBL9696520 0.81
SCHEMBL14355440 0.80 DGAT1 (0.34) DGAT1TSHRHSD17B10
SCHEMBL12893060 0.80 DGAT1 (0.34) DGAT1
SCHEMBL178785 0.80 DGAT1 (0.34) DGAT1TSHRHSD17B10
SCHEMBL10093689 0.80 DGAT1 (0.34) DGAT1
SCHEMBL17266467 0.80 TSHR (0.35) TSHRHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 265 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024128279-A1 PEELING AGENT COMPOSITION FOR PHOTOIRRADIATION-BASED PEELING, LAMINATE, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE OR ELECTRONIC DEVICE LAYER 日産化学株式会社 2024-06-20 WO disclosed
WO-2024100181-A1 DSA OF LIQUID CRYSTAL BLOCK COPOLYMERS FOR INTEGRATED CIRCUIT PATTERNING MERCK PATENT GMBH (DE) 2024-05-16 WO disclosed
US-20240067836-A1 CONDUCTIVE STRUCTURE AND ANTISTATIC COMPOSITION INCLUDING THE SAME DAEJIN ADVANCED MATERIALS INC. (KR) 2024-02-29 US disclosed
WO-2023243475-A1 ADHESIVE COMPOSITION FOR LIGHT IRRADIATION PEELING, LAMINATE, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE OR ELECTRONIC DEVICE LAYER 日産化学株式会社 2023-12-21 WO disclosed
WO-2023238885-A1 METHACRYLIC RESIN, METHOD FOR PRODUCING SAME, RESIN COMPOSITION AND RESIN FILM 株式会社カネカ 2023-12-14 WO disclosed
WO-2023238886-A1 METHACRYLIC RESIN AND METHOD FOR PRODUCING SAME, RESIN COMPOSITION, DOPE, AND RESIN FILM 株式会社カネカ 2023-12-14 WO disclosed
EP-3831613-B1 PLANOGRAPHIC PRINTING PLATE PRECURSOR FUJIFILM CORP (JP) 2023-09-06 EP disclosed
EP-3831614-B1 PLANOGRAPHIC PRINTING PLATE ORIGINAL PLATE, PLANOGRAPHIC PRINTING PLATE ORIGINAL PLATE LAMINATE BODY, PLATEMAKING METHOD FOR PLANOGRAPHIC PRINTING PLATE, AND PLANOGRAPHIC PRINTING METHOD FUJIFILM CORP (JP) 2023-09-06 EP disclosed
EP-3677435-B1 PRINTING PLATE PRECURSOR AND PRINTING PLATE PRECURSOR LAMINATE FUJIFILM CORP (JP) 2023-09-06 EP disclosed
WO-2023149421-A1 TRANSPARENT RESIN SUBSTRATE FOR FLEXIBLE DISPLAY, AND HARD COAT FILM 株式会社カネカ 2023-08-10 WO disclosed
US-7232644-B2 Polymerizable composition and negative-working planographic printing plate precursor using the same FUJIFILM CORPORATION (JP) 2007-06-19 US disclosed
US-20070134590-A1 Resin showing an increase in solubility in alkali developer by action of an acid, a compound being capable of generating an acid when irradiated with an actinic ray or radiation, an acrylic resin with silicon-containing units and being stable to acids but insoluble in alkali developer, solvent FUJIFILM CORPORATION. (JP) 2007-06-14 US disclosed
US-20070122741-A1 Resist protective coating material and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-05-31 US disclosed
US-20070087288-A1 Positive-working photosensitive composition and pattern forming method using the same FUJIFILM CORPORATION 2007-04-19 US disclosed
US-20070082289-A1 Photosensitive composition, pattern forming method using the photosensitive composition and compound for use in the photosensitive composition FUJI PHOTO FILM CO., LTD. 2007-04-12 US disclosed
US-20070072118-A1 Positive photosensitive composition and pattern forming method using the same FUJI PHOTO FILM CO., LTD. 2007-03-29 US disclosed
EP-1767379-A1 Infrared-sensitive planographic printing plate precursor FUJIFILM Corporation (JP) 2007-03-28 EP disclosed
US-20070046715-A1 Image forming apparatus FUJI PHOTO FILM CO., LTD. 2007-03-01 US disclosed
US-20070026344-A1 Infrared-sensitive planographic printing plate precursor FUJI PHOTO FILM CO., LTD. 2007-02-01 US disclosed
US-20070003867-A1 Resist protective coating material and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-01-04 US disclosed