Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 2/20 | 0.37 |
| ▸ | CNR1 | P21554 | 1/20 | 0.37 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.37 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.37 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.37 |
| ▸ | ABCC3 | O15438 | 1/20 | 0.36 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29048582 | 0.76 | — | — | |
| SCHEMBL10456663 | 0.74 | — | — | |
| SCHEMBL9881104 | 0.73 | HRH4 (0.32) | — | |
| SCHEMBL25180021 | 0.73 | — | — | |
| SCHEMBL5050682 | 0.72 | LMNA (0.42) | LMNACNR1ADRA1ATDP1KDM4E | |
| SCHEMBL1070660 | 0.72 | TP53 (0.34) | LMNAKDM4E | |
| SCHEMBL1071961 | 0.72 | CYP2C19 (0.31) | KDM4E | |
| Hydrochloric Acid SCHEMBL9062189 | 0.72 | HRH4 (0.31) | — | |
| SCHEMBL959628 | 0.70 | ALDH1A1 (0.34) | LMNATDP1SMN1; SMN2 | |
| SCHEMBL2851932 | 0.70 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20070299165-A1 | Phenyl-containing silicone epoxy formulations useful as encapsulants for LED applications | GELCORE LLC | 2007-12-27 | — | — | US | claimed |
| US-20240240011-A1 | SEALING RESIN COMPOSITION | SUMITOMO BAKELITE CO., LTD. (JP) | 2024-07-18 | — | — | US | disclosed |
| WO-2024111588-A1 | STRUCTURE, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR MANUFACTURING STRUCTURE | 株式会社レゾナック | 2024-05-30 | — | — | WO | disclosed |
| US-20240118609-A1 | RESIN COMPOSITION FOR SOLDER RESIST, SOLDER RESIST FILM, AND CIRCUIT BOARD | SEKISUI KASEI CO., LTD. (JP) | 2024-04-11 | — | — | US | disclosed |
| EP-4350758-A1 | SEALING RESIN COMPOSITION | Sumitomo Bakelite Co.Ltd. (JP) | 2024-04-10 | — | — | EP | disclosed |
| US-20240055308-A1 | RESIN COMPOSITION FOR SEMICONDUCTOR SEALING, UNDERFILL MATERIAL, MOLD RESIN, AND SEMICONDUCTOR PACKAGE | SEKISUI KASEI CO., LTD. (JP) | 2024-02-15 | — | — | US | disclosed |
| US-20240006947-A1 | STATOR, ROTATING ELECTRIC MACHINE, AND METHOD OF MANUFACTURING STATOR | SUMITOMO BAKELITE CO., LTD. (JP) | 2024-01-04 | — | — | US | disclosed |
| US-11854919-B2 | Sealing composition and semiconductor device | RESONAC CORPORATION (JP) | 2023-12-26 | — | — | US | disclosed |
| EP-4276128-A1 | SEALING COMPOSITION AND SEMICONDUCTOR DEVICE | Resonac Corporation (JP) | 2023-11-15 | — | — | EP | disclosed |
| EP-4262059-A1 | STATOR, ROTATING ELECTRIC MACHINE, AND METHOD FOR MANUFACTURING STATOR | Sumitomo Bakelite Co., Ltd. (JP) | 2023-10-18 | — | — | EP | disclosed |
| US-20070299165-A1 | Phenyl-containing silicone epoxy formulations useful as encapsulants for LED applications | GELCORE LLC | 2007-12-27 | — | — | US | disclosed |
| US-20070254986-A1 | contains mesophase pitch; cyclic phosphazenes; for semiconductors with narrow distances between pads or wires | HITACHI CHEMICAL CO., LTD. (JP) | 2007-11-01 | — | — | US | disclosed |
| US-20060014873-A1 | Encapsulating epoxy resin composition, and electronic parts device using the same | HITACHI CHEMICAL CO., LTD. (JP) | 2006-01-19 | — | — | US | disclosed |
| US-20050282975-A1 | Silicone epoxy formulations | GELCORE LLC. | 2005-12-22 | — | — | US | disclosed |
| US-20050282976-A1 | Silicone epoxy formulations | GELCORE LLC. | 2005-12-22 | — | — | US | disclosed |
| US-20050267286-A1 | Curing accelerator for curing resin, curing resin composition, electronic component device and method for producing phosphine derivative | HITACHI CHEMICAL CO., LTD. (JP) | 2005-12-01 | — | — | US | disclosed |
| US-20050222300-A1 | Encapsulating epoxy resin composition, and electronic parts device using the same | HITACHI CHEMICAL CO., LTD. (JP) | 2005-10-06 | — | — | US | disclosed |
| US-20050165202-A1 | Curing accelerator for curing resin, curing resin composition and electronic component device | HITACHI CHEMICAL CO., LTD. (JP) | 2005-07-28 | — | — | US | disclosed |
| WO-2003072628-A1 | ENCAPSULATING EPOXY RESIN COMPOSITION, AND ELECTRONIC PARTS DEVICE USING THE SAME | HITACHI CHEMICAL CO., LTD. (JP) | 2003-09-04 | — | — | WO | disclosed |
| WO-2003072655-A1 | ENCAPSULATING EPOXY RESIN COMPOSITION, AND ELECTRONIC PARTS DEVICE USING THE SAME | HITACHI CHEMICAL CO., LTD. (JP) | 2003-09-04 | — | — | WO | disclosed |