SCHEMBL3232159

SCHEMBL3232159

CCCONC(N)=S

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3229828 0.85
SCHEMBL3227325 0.78
SCHEMBL28232060 0.76
SCHEMBL6155343 0.74
SCHEMBL28959211 0.74
SCHEMBL1756689 0.74
Hydrochloric Acid SCHEMBL11080400 0.72
Hydrochloric Acid SCHEMBL27509464 0.72 NOS3 (0.32)
SCHEMBL9344941 0.70 TP53 (0.38)
Propanol SCHEMBL27533077 0.69 CNR2 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111659451-B Preparation method and application of nitrogen vacancy-containing few-layer porous carbon nitride photocatalyst 中国科学院山西煤炭化学研究所 2023-03-24 CN disclosed
CN-111659451-A Preparation method and application of nitrogen vacancy-containing few-layer porous carbon nitride photocatalyst 中国科学院山西煤炭化学研究所 2020-09-15 CN disclosed
US-20100068480-A1 Negative-working photosensitive resin composition and photosensitive resin plate using the same CITICORP NORTH AMERICA, INC., AS AGENT 2010-03-18 US disclosed
US-20090068413-A1 Negative-working photosensitive resin composition and photosensitive resin plate using the same TAKANASHI HIROSHI 2009-03-12 US disclosed
US-20060275702-A1 Negative-working photosensitive resin composition and photosensitive resin plate using the same TAKANASHI HIROSHI 2006-12-07 US disclosed
US-20060057495-A1 Negative-working photosensitive resin composition and photosensitive resin plate using the same TAKANASHI HIROSHI 2006-03-16 US disclosed
US-20010019811-A1 Negative-working photosensitive resin composition and photosensitive resin plate using the same TAKANASHI HIROSHI (JP) 2001-09-06 US disclosed