⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3239198 | 1.00 | — | — | |
| SCHEMBL4020194 | 0.82 | — | — | |
| SCHEMBL4020195 | 0.82 | — | — | |
| SCHEMBL3239560 | 0.68 | — | — | |
| SCHEMBL1742221 | 0.65 | — | — | |
| SCHEMBL3344391 | 0.65 | — | — | |
| SCHEMBL3185485 | 0.64 | — | — | |
| SCHEMBL3950005 | 0.64 | — | — | |
| SCHEMBL8464385 | 0.63 | — | — | |
| SCHEMBL3341645 | 0.63 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7737028-B2 | Selective ruthenium deposition on copper materials | APPLIED MATERIALS, INC. (US) | 2010-06-15 | — | — | US | claimed |
| US-20090087982-A1 | SELECTIVE RUTHENIUM DEPOSITION ON COPPER MATERIALS | APPLIED MATERIALS, INC. | 2009-04-02 | — | — | US | claimed |
| WO-2022209982-A1 | METHOD FOR FORMING RUTHENIUM FILM AND PROCESSING APPARATUS | 東京エレクトロン株式会社 | 2022-10-06 | — | — | WO | disclosed |
| US-10163699-B2 | Cu wiring forming method and semiconductor device manufacturing method | TOKYO ELECTRON LIMITED (JP) | 2018-12-25 | — | — | US | disclosed |
| US-20180047624-A1 | Cu WIRING FORMING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | TOKYO ELECTRON LIMITED (JP) | 2018-02-15 | — | — | US | disclosed |
| US-9735046-B2 | Semiconductor device manufacturing method and storage medium | TOKYO ELECTRON LIMITED (JP) | 2017-08-15 | — | — | US | disclosed |
| US-20170062269-A1 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND STORAGE MEDIUM | TOKYO ELECTRON LIMITED (JP) | 2017-03-02 | — | — | US | disclosed |
| US-9425093-B2 | Copper wiring forming method, film forming system, and storage medium | TOKYO ELECTRON LIMITED (JP) | 2016-08-23 | — | — | US | disclosed |
| US-9406557-B2 | Copper wiring forming method with Ru liner and Cu alloy fill | TOKYO ELECTRON LIMITED (JP) | 2016-08-02 | — | — | US | disclosed |
| US-9368418-B2 | Copper wiring structure forming method | TOKYO ELECTRON LIMITED (JP) | 2016-06-14 | — | — | US | disclosed |
| US-20160163591-A1 | COPPER WIRING FORMING METHOD, FILM FORMING SYSTEM, AND STORAGE MEDIUM | TOKYO ELECTRON LIMITED (JP) | 2016-06-09 | — | — | US | disclosed |
| US-20140175046-A1 | METHOD FOR FORMING COPPER WIRING | TOKYO ELECTRON LIMITED (JP) | 2014-06-26 | — | — | US | disclosed |
| US-20140161992-A1 | METHOD FOR FORMING COPPER WIRING | TOKYO ELECTRON LIMITED (JP) | 2014-06-12 | — | — | US | disclosed |
| US-20140030886-A1 | METHOD FOR FORMING COPPER WIRING | TOKYO ELECTRON LIMITED (JP) | 2014-01-30 | — | — | US | disclosed |
| US-8399353-B2 | Methods of forming copper wiring and copper film, and film forming system | TOKYO ELECTRON LIMITED (JP) | 2013-03-19 | — | — | US | disclosed |
| US-20120196437-A1 | METHODS OF FORMING COPPER WIRING AND COPPER FILM, AND FILM FORMING SYSTEM | TOKYO ELECTRON LIMITED (JP) | 2012-08-02 | — | — | US | disclosed |
| US-20120196052-A1 | METHOD OF FORMING COPPER WIRING AND METHOD AND SYSTEM FOR FORMING COPPER FILM | TOKYO ELECTRON LIMITED (JP) | 2012-08-02 | — | — | US | disclosed |
| US-7737028-B2 | Selective ruthenium deposition on copper materials | APPLIED MATERIALS, INC. (US) | 2010-06-15 | — | — | US | disclosed |
| US-20090087982-A1 | SELECTIVE RUTHENIUM DEPOSITION ON COPPER MATERIALS | APPLIED MATERIALS, INC. | 2009-04-02 | — | — | US | disclosed |
| US-6605735-B2 | Ruthenium complex, process for producing the same and process for producing thin film | TOSOH CORPORATION (JP) | 2003-08-12 | — | — | US | disclosed |