SCHEMBL3242972

SCHEMBL3242972

C=CC[SiH2]OCCCCC

nearest known ligand 0.39

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
TSHR P16473 6/20 0.39
ALDH1A1 P00352 1/20 0.37
HPGD P15428 1/20 0.32
GBA1 P04062 1/20 0.32
PLA2G2C Q5R387 1/20 0.30
CA1 P00915 2/20 0.30
CA2 P00918 2/20 0.30
CA9 Q16790 2/20 0.30
MEN1 O00255 1/20 0.30
THRB P10828 1/20 0.30
HTT P42858 1/20 0.30
KMT2A Q03164 1/20 0.30
CA12 O43570 1/20 0.30
MAPT P10636 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15266070 0.98 TSHR (0.43) TSHRALDH1A1GBA1PLA2G2CCA1
SCHEMBL15309363 0.93
SCHEMBL22654117 0.79 ALDH1A1 (0.30) ALDH1A1
SCHEMBL761395 0.75 CA1 (0.32) CA1CA2CA9MEN1THRB
SCHEMBL27626717 0.74
SCHEMBL14633833 0.73
SCHEMBL22654284 0.72
SCHEMBL5321508 0.72 THRB (0.35) TSHRCA1CA2CA9MEN1
SCHEMBL9009709 0.72 THRB (0.42) TSHRCA1CA2CA9MEN1
SCHEMBL1426823 0.72 THRB (0.42) TSHRCA1CA2CA9MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113372772-A Coating composition for separator, method of preparing separator using the same, separator, and lithium battery including the separator 三星SDI株式会社 2021-09-10 CN claimed
CN-115322438-A Low-crystallization-temperature methyl alkoxy acetoxy silane mixture and preparation method and application thereof 湖北新蓝天新材料股份有限公司 2022-11-11 CN disclosed
EP-1837902-B1 Use of organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices DOW GLOBAL TECHNOLOGIES LLC (US) 2017-05-24 EP disclosed
EP-1493182-B1 TRI-LAYER MASKING ARCHITECTURE FOR PATTERNING DUAL DAMASCENE INTERCONNECTS DOW GLOBAL TECHNOLOGIES LLC (US) 2013-01-23 EP disclosed
EP-1493183-B1 PROCESS FOR MAKING AIR GAP CONTAINING SEMICONDUCTING DEVICES AND RESULTING SEMICONDUCTING DEVICE DOW GLOBAL TECHNOLOGIES LLC (US) 2012-12-05 EP disclosed
US-20100196487-A1 COMPOSITION WITH ANTIMICROBIAL EFFECT TROVOTECH GMBH (DE) 2010-08-05 US disclosed
EP-1837902-A2 Use of organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices Dow Global Technologies Inc. (US) 2007-09-26 EP disclosed
US-7268200-B2 Organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices DOW GLOBAL TECHNOLOGIES INC. (US) 2007-09-11 US disclosed
US-7115531-B2 Organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices DOW GLOBAL TECHNOLOGIES INC. (US) 2006-10-03 US disclosed
US-20060063393-A1 Organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices DOW GLOBAL TECHNOLOGIES INC. 2006-03-23 US disclosed
US-20050124172-A1 Process for making air gap containing semiconducting devices and resulting semiconducting device DOW GLOBAL TECHNOLOGIES LLC 2005-06-09 US disclosed
EP-1493183-A2 PROCESS FOR MAKING AIR GAP CONTAINING SEMICONDUCTING DEVICES AND RESULTING SEMICONDUCTING DEVICE DOW GLOBAL TECHNOLOGIES INC. (US) 2005-01-05 EP disclosed
EP-1493182-A1 TRI-LAYER MASKING ARCHITECTURE FOR PATTERNING DUAL DAMASCENE INTERCONNECTS Dow Global Technologies Inc. (US) 2005-01-05 EP disclosed
US-6815333-B2 Tri-layer masking architecture for patterning dual damascene interconnects DOW GLOBAL TECHNOLOGIES INC. 2004-11-09 US disclosed
US-20030219973-A1 Tri-layer masking architecture for patterning dual damascene interconnects DOW GLOBAL TECHNOLOGIES LLC 2003-11-27 US disclosed
WO-2003085724-A1 TRI-LAYER MASKING ARCHITECTURE FOR PATTERNING DUAL DAMASCENE INTERCONNECTS DOW GLOBAL TECHNOLOGIES INC. (US) 2003-10-16 WO disclosed
WO-2003085719-A2 PROCESS FOR MAKING AIR GAP CONTAINING SEMICONDUCTING DEVICES AND RESULTING SEMICONDUCTING DEVICE DOW GLOBAL TECHNOLOGIES INC. (US) 2003-10-16 WO disclosed
EP-1314193-A2 ORGANOSILICATE RESINS AS HARDMASKS FOR ORGANIC POLYMER DIELECTRICS IN FABRICATION OF MICROELECTRONIC DEVICES DOW GLOBAL TECHNOLOGIES INC. (US) 2003-05-28 EP disclosed
US-20020052125-A1 Organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices DOW BELGIUM N.V. (BE) 2002-05-02 US disclosed
WO-2002016477-A2 ORGANOSILICATE RESINS AS HARDMASKS FOR ORGANIC POLYMER DIELECTRICS IN FABRICATION OF MICROELECTRONIC DEVICES DOW GLOBAL TECHNOLOGIES INC. (US) 2002-02-28 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20100196487-A1 COMPOSITION WITH ANTIMICROBIAL EFFECT CAPG, PRF1, CD68 TSHR 4411/4885ALDH1A1 4054/4885HPGD 1867/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.