SCHEMBL3267916

SCHEMBL3267916

CC1C(=O)N(C)C(=S)N(C)C1=O

nearest known ligand 0.35

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.35
BLM P54132 1/20 0.35
KMT2A Q03164 1/20 0.35
GSK3A P49840 1/20 0.31
GSK3B P49841 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10311254 0.82
SCHEMBL200674 0.77 MAPT (0.41) MEN1BLMKMT2AGSK3AGSK3B
SCHEMBL22281755 0.76 GAA (0.32) GSK3AGSK3B
SCHEMBL1263355 0.74 MAPT (0.40) MEN1BLMKMT2AGSK3AGSK3B
SCHEMBL1263023 0.74 MAPT (0.40) MEN1BLMKMT2AGSK3AGSK3B
SCHEMBL4006398 0.74 MAPT (0.40) MEN1BLMKMT2AGSK3AGSK3B
SCHEMBL13438551 0.74 MEN1 (0.34) MEN1KMT2A
SCHEMBL9612339 0.72 MEN1 (0.35) MEN1BLMKMT2A
SCHEMBL6162735 0.72 ALDH1A1 (0.43) MEN1KMT2A
SCHEMBL5266922 0.72 MAPT (0.35) MEN1BLMKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9875904-B2 Silicon etching liquid, silicon etching method, and microelectromechanical element MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2018-01-23 US claimed
US-20150340241-A1 SILICON ETCHING LIQUID, SILICON ETCHING METHOD, AND MICROELECTROMECHANICAL ELEMENT MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2015-11-26 US claimed
JP-4126703-A None JP disclosed
US-9875904-B2 Silicon etching liquid, silicon etching method, and microelectromechanical element MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2018-01-23 US disclosed
US-20150340241-A1 SILICON ETCHING LIQUID, SILICON ETCHING METHOD, AND MICROELECTROMECHANICAL ELEMENT MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2015-11-26 US disclosed
EP-0694298-B1 PREFORMED GLASS IONOMER FILLER WHICH CAN SUSTAINEDLY RELEASE FLUORIDE ION AND DENTAL COMPOSITION CONTAINING THE SAME SHOFU INC (JP) 2010-06-09 EP disclosed
US-5883153-A SUSTAINED RELEASE GLASS IONOMERS SHOFU INC. (JP) 1999-03-16 US disclosed
EP-0480785-B1 Polymerization initiator composition controlling polymerization at interface and curable composition containing same TERUMO CORP (JP) 1996-12-27 EP disclosed
EP-0694298-A1 PREFORMED GLASS IONOMER FILLER WHICH CAN SUSTAINEDLY RELEASE FLUORIDE ION AND DENTAL COMPOSITION CONTAINING THE SAME SHOFU INC. (JP) 1996-01-31 EP disclosed
US-5264513-A Dental adhesive KABUSHIKI KAISHA SHOFU (JP) 1993-11-23 US disclosed
US-5166117-A (thio)barbituric acid and metal halide as polymerization catalysts TERUMO KABUSHIKI KAISHA (JP) 1992-11-24 US disclosed
JP-H04126703-A POLYMERIZATION INITIATOR COMPOSITION OF CONTROLLING POLYMERIZATION ON INTERFACE AND CURABLE COMPOSITION CONTAINING THE SAME COMPOSITION TERUMO CORP 1992-04-27 JP disclosed
EP-0480785-A2 Polymerization initiator composition controlling polymerization at interface and curable composition containing same TERUMO KABUSHIKI KAISHA (JP) 1992-04-15 EP disclosed