SCHEMBL3283108

SCHEMBL3283108

Nc1cccc(S(=O)(=O)Oc2ccccc2)c1N

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 6/20 0.47
CA2 P00918 6/20 0.47
CA9 Q16790 6/20 0.47
GAA P10253 1/20 0.44
HTR6 P50406 1/20 0.43
CA12 O43570 2/20 0.42
CA4 P22748 2/20 0.42
CYP2C9 P11712 2/20 0.42
CA6 P23280 1/20 0.42
CA5A P35218 1/20 0.42
CA7 P43166 1/20 0.42
CA14 Q9ULX7 1/20 0.42
CA5B Q9Y2D0 1/20 0.42
LMNA P02545 2/20 0.42
KMT2A Q03164 3/20 0.40
MEN1 O00255 2/20 0.40
NPC1 O15118 1/20 0.40
RAB9A P51151 1/20 0.40
SENP8 Q96LD8 1/20 0.40
SENP7 Q9BQF6 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL534724 0.87 GAA (0.54) CA1CA2CA9GAAHTR6
SCHEMBL29516284 0.87 GAA (0.54) CA1CA2CA9GAAHTR6
SCHEMBL1458540 0.81 CA1 (0.43) CA1CA2CA9GAAHTR6
SCHEMBL28473215 0.75 CA2 (0.51) CA1CA2CA9GAAHTR6
SCHEMBL8989782 0.74 CA1 (0.46) CA1CA2CA9GAALMNA
SCHEMBL7180736 0.73 CA1 (0.48) CA1CA2CA9CYP2C9LMNA
SCHEMBL5176359 0.73 CA1 (0.53) CA1CA2CA9HTR6LMNA
SCHEMBL30272576 0.72 GAA (0.65) CA1CA2CA9GAAHTR6
SCHEMBL1660714 0.72 GAA (0.65) CA1CA2CA9GAAHTR6
SCHEMBL15444 0.72 HTR6 (0.74) CA1CA2CA9GAAHTR6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 58 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0415447-A1 Liquid crystal device CANON KABUSHIKI KAISHA (JP) 1991-03-06 EP claimed
JP-6264043-A None JP disclosed
CN-118251440-A Copolymers derived from dicyclopentadiene 高新特殊工程塑料全球技术有限公司 2024-06-25 CN disclosed
CN-118139910-A Linear block copolymers and curable thermosetting compositions comprising the same 高新特殊工程塑料全球技术有限公司 2024-06-04 CN disclosed
CN-118119648-A Graft copolymer and curable thermosetting composition comprising the same 高新特殊工程塑料全球技术有限公司 2024-05-31 CN disclosed
CN-117255812-A Blocked bisphenol polydiindane oligomers and compositions, methods of manufacture, and articles made therefrom 高新特殊工程塑料全球技术有限公司 2023-12-19 CN disclosed
CN-117242119-A End capped bisphenol polyether oligomers and compositions, methods of making, and articles made therefrom 高新特殊工程塑料全球技术有限公司 2023-12-15 CN disclosed
EP-2966194-B1 ZINC-BASED COMPOSITE MATERIAL AND USE THEREOF RETUG INC (JP) 2020-04-22 EP disclosed
CN-106232589-B Tetracarboxylic dianhydride, polyamic acid, polyimides and those manufacturing method and polyamic acid solution 捷客斯能源株式会社 2019-10-22 CN disclosed
EP-3109042-B1 RESIN-COATED METAL SHEET FOR CONTAINER JFE STEEL CORP (JP) 2019-10-16 EP disclosed
CN-1930332-A Carbon fiber, process for production thereof, prepregs, and golf club shafts TORAY INDUSTRIES (JP) 2007-03-14 CN disclosed
CN-1871533-A laminated film NITTO DENKO CORP (JP) 2006-11-29 CN disclosed
CN-1871284-A Resin sheet for optical use and base plate for liquid crystal cell comprising said resin sheet for optical use, liquid crystal display device, base plate for image display device, and image display de NITTO DENKO CORP (JP) 2006-11-29 CN disclosed
US-6096411-A COMPRISING 70-90 WT % OF COPPER PARTICLES OF AN AVERAGE PARTICLE SIZE OF 0.5-8 MU M, 0.5-15 WT % OF INSULATING PARTICLES OF AN AVERAGE PARTICLE SIZE OF 10-20 MU M, 6-17 WT % OF THERMOSETTING TYPE LIQUID EPOXY RESIN MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2000-08-01 US disclosed
EP-0536749-B1 Polyhydric phenol, and epoxy resin and epoxy resin composition derived therefrom SUMITOMO CHEMICAL CO (JP) 1998-03-11 EP disclosed
US-5560968-A USING GLYCIDYL ETHER OF BISPHENOL CYCLOHEXANE SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1996-10-01 US disclosed
US-5462997-A Curable novolak-glycidol condensates SUMITOMO CHEMICAL CO., LTD. (JP) 1995-10-31 US disclosed
US-5395912-A Encapsulated electronics; heat resistance; noncracking; less hygroscopic SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1995-03-07 US disclosed
JP-H06264043-A THERMOSETTING RESIN COMPOSITION, MOLDED ARTICLE WITH ADHESIVE LAYER, AND METHOD FOR ADHESION NIPPON ZEON CO LTD 1994-09-20 JP disclosed
EP-0536749-A1 Polyhydric phenol, and epoxy resin and epoxy resin composition derived therefrom SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1993-04-14 EP disclosed