SCHEMBL3291920

SCHEMBL3291920

CC(=O)Oc1ccc(Oc2ccc(COC(=O)C3CC4C=CC3C4)cc2)cc1

nearest known ligand 0.52

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 9/20 0.52
HPGD P15428 1/20 0.52
POLB P06746 3/20 0.46
KMT2A Q03164 2/20 0.46
RAB9A P51151 1/20 0.41
APEX1 P27695 1/20 0.40
RECQL P46063 1/20 0.40
BLM P54132 1/20 0.40
ESR2 Q92731 1/20 0.40
HSD17B10 Q99714 1/20 0.40
TDP1 Q9NUW8 1/20 0.40
L3MBTL1 Q9Y468 1/20 0.40
MAPK1 P28482 2/20 0.37
LMNA P02545 1/20 0.36
MAPT P10636 1/20 0.36
ESR1 P03372 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3296205 0.96 ALDH1A1 (0.55) ALDH1A1HPGDPOLBKMT2ARAB9A
SCHEMBL21895665 0.84 ALDH1A1 (0.69) ALDH1A1HPGDPOLBKMT2ARAB9A
SCHEMBL21895660 0.81 ALDH1A1 (0.53) ALDH1A1HPGDPOLBKMT2ARAB9A
SCHEMBL21895675 0.80 ALDH1A1 (0.53) ALDH1A1HPGDPOLBKMT2ARAB9A
SCHEMBL21895372 0.80 ALDH1A1 (0.53) ALDH1A1HPGDPOLBKMT2ARAB9A
SCHEMBL21895676 0.79 ALDH1A1 (0.51) ALDH1A1HPGDPOLBKMT2ARAB9A
SCHEMBL2994567 0.79 ALDH1A1 (0.64) ALDH1A1HPGDPOLBKMT2ARAB9A
SCHEMBL10532151 0.79 ALDH1A1 (0.64) ALDH1A1HPGDPOLBKMT2ARAB9A
SCHEMBL3293941 0.78 KMT2A (0.52) ALDH1A1HPGDPOLBKMT2ARAB9A
SCHEMBL3294863 0.78 ALDH1A1 (0.49) ALDH1A1HPGDPOLBKMT2ARAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7727705-B2 High etch resistant underlayer compositions for multilayer lithographic processes FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2010-06-01 US disclosed
WO-2008140846-A1 HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-11-20 WO disclosed
US-20080206667-A1 HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. 2008-08-28 US disclosed