Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28262378 | 0.93 | FAAH (0.33) | CYP3A4FAAH | |
| SCHEMBL28263474 | 0.91 | FAAH (0.36) | FAAH | |
| SCHEMBL28262391 | 0.91 | FAAH (0.36) | FAAH | |
| SCHEMBL28263531 | 0.91 | FAAH (0.36) | FAAH | |
| SCHEMBL19356728 | 0.91 | FAAH (0.36) | FAAH | |
| SCHEMBL28924380 | 0.91 | FAAH (0.36) | FAAH | |
| SCHEMBL19356655 | 0.91 | FAAH (0.36) | FAAH | |
| SCHEMBL28263524 | 0.91 | FAAH (0.36) | FAAH | |
| SCHEMBL22661046 | 0.88 | CYP3A4 (0.30) | CYP3A4 | |
| SCHEMBL22661039 | 0.86 | ALDH1A1 (0.34) | FAAH |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110760101-A | Plastic additive capable of improving impact resistance and preparation method thereof | 科迈特新材料有限公司 | 2020-02-07 | — | — | CN | claimed |
| CN-116075368-B | Resin composition, cured product, method for producing same, and laminate | 三菱化学株式会社 | 2024-06-11 | — | — | CN | disclosed |
| CN-116075368-A | Resin composition, cured product, method for producing same, and laminate | 三菱化学株式会社 | 2023-05-05 | — | — | CN | disclosed |
| WO-2022054912-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | 三菱ケミカル株式会社 | 2022-03-17 | — | — | WO | disclosed |
| CN-108250754-B | Silicon-containing resin composition, silicon-containing resin film, silica film, light-emitting display element panel, and light-emitting display device | 东京应化工业株式会社 | 2022-01-25 | — | — | CN | disclosed |
| CN-109641482-B | Preparation of cis-1, 4-polydienes having multiple silane functional groups prepared by in situ hydrosilylation of polymer glues | 株式会社普利司通 | 2021-11-05 | — | — | CN | disclosed |
| WO-2020235325-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER | 東京応化工業株式会社 (JP) | 2020-11-26 | — | — | WO | disclosed |
| WO-2020230828-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER | 東京応化工業株式会社 | 2020-11-19 | — | — | WO | disclosed |
| CN-107922733-B | Polyimide precursor composition | 东京应化工业株式会社 | 2020-09-11 | — | — | CN | disclosed |
| CN-110760101-A | Plastic additive capable of improving impact resistance and preparation method thereof | 科迈特新材料有限公司 | 2020-02-07 | — | — | CN | disclosed |
| WO-2008104874-A1 | PROCESS FOR MAKING SILOXANE POLYMERS | AZ ELECTRONIC MATERIALS USA CORP. (DE) | 2008-09-04 | — | — | WO | disclosed |
| WO-2008102259-A2 | ANTIREFLECTIVE COATING COMPOSITION BASED ON A SILICON POLYMER | AZ ELECTRONIC MATERIALS USA CORP. (DE) | 2008-08-28 | — | — | WO | disclosed |
| US-20080199789-A1 | Antireflective Coating Composition Based on Silicon Polymer | MERCK PATENT GMBH (DE) | 2008-08-21 | — | — | US | disclosed |
| US-20070298349-A1 | Antireflective Coating Compositions Comprising Siloxane Polymer | AZ ELECTRONIC MATERIALS USA CORP. | 2007-12-27 | — | — | US | disclosed |
| WO-2007148223-A2 | ANTIREFLECTIVE COATING COMPOSITIONS COMPRISING SILOXANE POLYMER | AZ ELECTRONIC MATERIALS USA CORP. (DE) | 2007-12-27 | — | — | WO | disclosed |
| EP-1641908-A1 | CLEANING COMPOSITION, METHOD OF CLEANING SEMICONDUCTOR SUBSTRATE, AND METHOD OF FORMING WIRING ON SEMICONDUCTOR SUBSTRATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-04-05 | — | — | EP | disclosed |
| WO-2004113486-A1 | CLEANING COMPOSITION, METHOD OF CLEANING SEMICONDUCTOR SUBSTRATE, AND METHOD OF FORMING WIRING ON SEMICONDUCTOR SUBSTRATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2004-12-29 | — | — | WO | disclosed |
| US-20040259761-A1 | Cleaning composition, method of cleaning semiconductor substrate, and method of forming wiring on semiconductor substrate | TOKYO OHKA KOGYO CO., LTD. INTEL CORPORATION | 2004-12-23 | — | — | US | disclosed |
| US-6515073-B2 | Comprising di-, tri- and/or tetra-(alkoxy/phenoxy)silanes and a thermosetting resin which can be condensed therewith which has an absorption capacity with respect to exposing light; can be etched at high rate for fine resist patterns | TOKYO OHKA KOGYO CO., LTD. (JP) | 2003-02-04 | — | — | US | disclosed |
| US-20010036998-A1 | Anti-reflective coating-forming composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-11-01 | — | — | US | disclosed |