SCHEMBL3303720

SCHEMBL3303720

C=CC(=O)OC1C2CC3C(=O)OC1C3C2.C=CC(=O)OC1CC2CCC1C2

nearest known ligand 0.42

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ATM Q13315 1/20 0.42
CYP19A1 P11511 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9975638 0.87
SCHEMBL22399918 0.87
SCHEMBL14549206 0.87
SCHEMBL415325 0.87
SCHEMBL3305897 0.83 ATM (0.33) ATMCYP19A1
SCHEMBL12190159 0.82
SCHEMBL21010755 0.80 ATM (0.31) ATM
SCHEMBL15147128 0.78 POLB (0.35)
SCHEMBL641536 0.78 ATM (0.65) ATMCYP19A1
SCHEMBL29353750 0.78 ATM (0.65) ATMCYP19A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7816471-B2 Process for producing photoresist polymeric compounds DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2010-10-19 US disclosed
US-20100099836-A1 PROCESS FOR PRODUCING PHOTORESIST POLYMERIC COMPOUNDS WATANABE HITOSHI 2010-04-22 US disclosed
US-7662897-B2 dropping polymerization of monomers such as 1-hydroxy-3-methacryloyloxyadamantane (HMA), 5-methacryloyloxy-2,6-norbornane carbolactone (MNBL), 2-methacryloyloxy-2-methyladamantane (2-MMA), solvent extraction, redissolving, desolventing; purification; metal-free DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2010-02-16 US disclosed
US-7655743-B2 Process for producing photoresist polymeric compounds DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2010-02-02 US disclosed
US-20080268377-A1 PROCESS FOR PRODUCING PHOTORESIST POLYMERIC COMPOUNDS WATANABE HITOSHI 2008-10-30 US disclosed
EP-1491560-B1 PROCESS FOR THE PRODUCTION OF HIGH-MOLECULAR COMPOUNDS FOR PHOTORESIST DAICEL CHEM (JP) 2007-11-21 EP disclosed
US-20060116494-A1 Process for producing photoresist polymeric compounds WATANABE HITOSHI 2006-06-01 US disclosed
US-20060116493-A1 Process for producing photoresist polymeric compounds WATANABE HITOSHI 2006-06-01 US disclosed
US-7015291-B2 Process for the production of high-molecular compounds for photoresist DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2006-03-21 US disclosed
US-20050100815-A1 Process for the production of high-molecular compounds for photoresist DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2005-05-12 US disclosed