SCHEMBL3305897

SCHEMBL3305897

C=C(C)C(=O)OC1C2CC3C(=O)OC1C3C2.C=C(C)C(=O)OC1CC2CCC1C2

nearest known ligand 0.33

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
ATM Q13315 2/20 0.33
CYP19A1 P11511 1/20 0.32
GRM1 Q13255 2/20 0.31
KDM4E B2RXH2 1/20 0.30
NPC1 O15118 1/20 0.30
POLB P06746 1/20 0.30
MAPT P10636 1/20 0.30
PKM P14618 1/20 0.30
HTT P42858 1/20 0.30
RECQL P46063 1/20 0.30
RAB9A P51151 1/20 0.30
TDP1 Q9NUW8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22840948 0.88 KDM4E (0.31) ATMKDM4ENPC1POLBMAPT
SCHEMBL19719271 0.88 KDM4E (0.31) ATMKDM4ENPC1POLBMAPT
SCHEMBL13088042 0.88 KDM4E (0.31) ATMKDM4ENPC1POLBMAPT
SCHEMBL15166539 0.88 KDM4E (0.31) ATMKDM4ENPC1POLBMAPT
SCHEMBL47307 0.88 KDM4E (0.31) ATMKDM4ENPC1POLBMAPT
SCHEMBL9975636 0.88 KDM4E (0.31) ATMKDM4ENPC1POLBMAPT
SCHEMBL74605 0.83 KDM4E (0.30) ATMKDM4ENPC1POLBMAPT
SCHEMBL19050201 0.83 KDM4E (0.30) ATMKDM4ENPC1POLBMAPT
SCHEMBL3303720 0.83 ATM (0.42) ATMCYP19A1
SCHEMBL13588254 0.81 ATM (0.32) ATMCYP19A1KDM4ENPC1POLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7816471-B2 Process for producing photoresist polymeric compounds DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2010-10-19 US disclosed
US-20100099836-A1 PROCESS FOR PRODUCING PHOTORESIST POLYMERIC COMPOUNDS WATANABE HITOSHI 2010-04-22 US disclosed
US-7662897-B2 dropping polymerization of monomers such as 1-hydroxy-3-methacryloyloxyadamantane (HMA), 5-methacryloyloxy-2,6-norbornane carbolactone (MNBL), 2-methacryloyloxy-2-methyladamantane (2-MMA), solvent extraction, redissolving, desolventing; purification; metal-free DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2010-02-16 US disclosed
US-7655743-B2 Process for producing photoresist polymeric compounds DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2010-02-02 US disclosed
US-20080268377-A1 PROCESS FOR PRODUCING PHOTORESIST POLYMERIC COMPOUNDS WATANABE HITOSHI 2008-10-30 US disclosed
EP-1491560-B1 PROCESS FOR THE PRODUCTION OF HIGH-MOLECULAR COMPOUNDS FOR PHOTORESIST DAICEL CHEM (JP) 2007-11-21 EP disclosed
US-20060116494-A1 Process for producing photoresist polymeric compounds WATANABE HITOSHI 2006-06-01 US disclosed
US-20060116493-A1 Process for producing photoresist polymeric compounds WATANABE HITOSHI 2006-06-01 US disclosed
US-7015291-B2 Process for the production of high-molecular compounds for photoresist DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2006-03-21 US disclosed
US-20050100815-A1 Process for the production of high-molecular compounds for photoresist DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2005-05-12 US disclosed