SCHEMBL330427

SCHEMBL330427

CC1(C)C[Si](C)(C)[SiH2][Si](c2ccccc2)(c2ccccc2)O1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL297374 0.83
SCHEMBL17419346 0.74
SCHEMBL18143560 0.72 HSD11B1 (0.31)
SCHEMBL19469319 0.69
SCHEMBL2525866 0.68
SCHEMBL7102827 0.67
SCHEMBL28430938 0.67
SCHEMBL296697 0.66
SCHEMBL94184 0.66
SCHEMBL29082263 0.66

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 284 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12516229-B2 Printable silicone composition and methods for its preparation and use DOW SILICONES CORPORATION (US) 2026-01-06 US claimed
EP-4288503-B1 PRINTABLE SILICONE COMPOSITION AND METHODS FOR ITS PREPARATION AND USE DOW SILICONES CORP (US) 2025-01-29 EP claimed
US-12103280-B2 Integral layered articles and their method of manufacture DOW GLOBAL TECHNOLOGIES LLC (US) 2024-10-01 US claimed
EP-4350793-A1 COMPOSITION AND METHOD FOR PRODUCING ELECTRONIC DEVICE USING SAME Panasonic Holdings Corporation (JP) 2024-04-10 EP claimed
US-20240057367-A1 COMPOSITION AND METHODS FOR MANUFACTURING ELECTRONIC DEVICE WITH THE COMPOSITION PANASONIC HOLDINGS CORPORATION (JP) 2024-02-15 US claimed
US-20230407012-A1 PRINTABLE SILICONE COMPOSITION AND METHODS FOR ITS PREPARATION AND USE DOW SILICONES CORPORATION 2023-12-21 US claimed
EP-4288503-A1 PRINTABLE SILICONE COMPOSITION AND METHODS FOR ITS PREPARATION AND USE Dow Silicones Corporation (US) 2023-12-13 EP claimed
CN-113214486-B Preparation method of epoxy-terminated organic silicon resin 南京林业大学 2022-09-23 CN claimed
CN-114315193-B Gypsum product water-draining and frost-removing agent and preparation method thereof 西安建筑科技大学 2022-09-16 CN claimed
US-20220250370-A1 INTEGRAL LAYERED ARTICLES AND THEIR METHOD OF MANUFACTURE DOW SILICONES CORPORATION 2022-08-11 US claimed
CN-108495896-B Polycarbonate resin composition 株式会社LG化学 2021-02-02 CN claimed
WO-2021016156-A1 INTEGRAL LAYERED ARTICLES AND THEIR METHOD OF MANUFACTURE DOW GLOBAL TECHNOLOGIES LLC (US) 2021-01-28 WO claimed
CN-111574809-A High-temperature-resistant modified phenolic resin thermal insulation material 安徽百维新材料有限公司 2020-08-25 CN claimed
CN-111440394-A Anti-oxidation PVC wood-plastic guardrail 安徽金喜龙新型建材有限公司 2020-07-24 CN claimed
EP-3375823-B1 POLYCARBONATE RESIN COMPOSITION LG CHEMICAL LTD (KR) 2019-07-24 EP claimed
US-20190016884-A1 POLYCARBONATE RESIN COMPOSITION LG CHEM, LTD. (KR) 2019-01-17 US claimed
EP-3375823-A1 POLYCARBONATE RESIN COMPOSITION LG Chem, Ltd. (KR) 2018-09-19 EP claimed
US-20160319103-A1 CURABLE COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICES HENKEL AG & CO KGAA (DE) 2016-11-03 US claimed
EP-2470574-A2 PROCESS AND CATALYST SYSTEM FOR POLYDIENE PRODUCTION Bridgestone Corporation (JP) 2012-07-04 EP claimed
WO-2011028523-A2 PROCESS AND CATALYST SYSTEM FOR POLYDIENE PRODUCTION BRIDGESTONE CORPORATION (JP) 2011-03-10 WO claimed