Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 10/20 | 0.64 |
| ▸ | CRHBP | P24387 | 1/20 | 0.50 |
| ▸ | CRHR2 | Q13324 | 1/20 | 0.50 |
| ▸ | ANPEP | P15144 | 2/20 | 0.49 |
| ▸ | DPP4 | P27487 | 2/20 | 0.49 |
| ▸ | FAAH | O00519 | 2/20 | 0.45 |
| ▸ | GABRA1 | P14867 | 2/20 | 0.43 |
| ▸ | GABRB2 | P47870 | 2/20 | 0.43 |
| ▸ | TLR9 | Q9NR96 | 1/20 | 0.43 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.42 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.41 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.41 |
| ▸ | NPEPPS | P55786 | 2/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2830698 | 0.91 | MGLL (0.55) | MGLLCRHBPCRHR2ANPEPDPP4 | |
| SCHEMBL3674228 | 0.88 | MGLL (0.56) | MGLLCRHBPCRHR2ANPEPDPP4 | |
| SCHEMBL30302476 | 0.88 | MGLL (0.56) | MGLLCRHBPCRHR2ANPEPDPP4 | |
| Methane SCHEMBL28428548 | 0.87 | MGLL (0.55) | MGLLCRHBPCRHR2ANPEPDPP4 | |
| SCHEMBL3772536 | 0.86 | MGLL (0.53) | MGLLCRHBPCRHR2ANPEPDPP4 | |
| SCHEMBL8014587 | 0.83 | MGLL (0.50) | MGLLFAAHPTGS1PTGS2 | |
| SCHEMBL28242042 | 0.81 | MGLL (0.47) | MGLLFAAHTLR9HSP90AA1PTGS1 | |
| SCHEMBL1535499 | 0.78 | MGLL (1.00) | MGLLFAAHTLR9HSP90AA1PTGS1 | |
| SCHEMBL29510771 | 0.78 | MGLL (1.00) | MGLLFAAHTLR9HSP90AA1PTGS1 | |
| SCHEMBL12962588 | 0.77 | CRHBP (0.57) | MGLLCRHBPCRHR2ANPEPDPP4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 597 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2407503-B1 | THERMOSETTING RESIN COMPOSITION OF SEMI-IPN COMPOSITE, AND VARNISH, PREPREG AND METAL CLAD LAMINATED BOARD USING THE SAME | HITACHI CHEMICAL CO LTD (JP) | 2020-01-08 | — | — | EP | claimed |
| EP-2141198-B1 | PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE | HITACHI CHEMICAL CO LTD (JP) | 2017-07-05 | — | — | EP | claimed |
| CN-103756315-B | A kind of compositions of thermosetting resin and application thereof | HUAWEI TECHNOLOGIES CO., LTD. (CN) | 2016-11-30 | — | — | CN | claimed |
| CN-103756315-A | Thermosetting resin composition and applications thereof | HUAWEI TECH CO LTD | 2014-04-30 | — | — | CN | claimed |
| CN-102336935-B | Thermocurable resin composition and varnish, prepreg and metal-clad laminate sheet using the same | HITACHI CHEMICAL CO LTD | 2013-12-11 | — | — | CN | claimed |
| US-8568891-B2 | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-10-29 | — | — | US | claimed |
| US-8513350-B2 | Forming patterned film; radiation transparent, reduced dielectrics, solvent resistance, waterproofing, acid and alkali resistance, heat resistance, adhesives properties to substrate | JNC CORPORATION (JP) | 2013-08-20 | — | — | US | claimed |
| CN-101370866-B | Thermosetting resin composition for semi-IPN composite, and varnish, prepreg and metal-clad laminate using same | HITACHI CHEMICAL CO LTD | 2013-07-17 | — | — | CN | claimed |
| CN-101668806-B | Method for producing resin varnish containing semi-IPN composite thermosetting resin, and resin varnish for printed wiring board, prepreg, and metal-clad laminate using same | HITACHI CHEMICAL CO LTD | 2013-06-19 | — | — | CN | claimed |
| EP-1985654-B1 | THERMOCURABLE RESIN COMPOSITION COMPRISING SEMI-IPN-TYPE COMPLEX, AND VARNISH, PREPREG AND METAL-CLAD LAMINATE SHEET USING THE SAME | HITACHI CHEMICAL CO LTD (JP) | 2013-04-10 | — | — | EP | claimed |
| CN-101370866-A | Thermosetting resin composition for semi-IPN composite, and varnish, prepreg and metal-clad laminate using same | HITACHI CHEMICAL CO LTD (JP) | 2009-02-18 | — | — | CN | claimed |
| EP-1985654-A1 | THERMOCURABLE RESIN COMPOSITION COMPRISING SEMI-IPN-TYPE COMPLEX, AND VARNISH, PREPREG AND METAL-CLAD LAMINATE SHEET USING THE SAME | Hitachi Chemical Co., Ltd. (JP) | 2008-10-29 | — | — | EP | claimed |
| US-20080207807-A1 | POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION | CHISSO CORPORATION (JP) | 2008-08-28 | — | — | US | claimed |
| WO-2008077141-A1 | RUBBER EPOXY CURATIVES AND METHODS FOR USE THEREOF | DESIGNER MOLECULES, INC. (US) | 2008-06-26 | — | — | WO | claimed |
| US-20080146738-A1 | RUBBER EPOXY CURATIVES AND METHODS FOR USE THEREOF | DESIGNER MOLECULES, INC. | 2008-06-19 | — | — | US | claimed |
| EP-1403297-B1 | Transparent heat-resistant resin optical material and film | TOSOH CORP (JP) | 2007-03-28 | — | — | EP | claimed |
| US-7001967-B2 | Resin with excellent heat resistance and dynamic characteristics, having negative birefringence and exhibiting a high refractive index and a high Abbe number, especially optical compensating members such as films, sheets and | TOSOH CORPORATION (JP) | 2006-02-21 | — | — | US | claimed |
| US-20040063887-A1 | Transparent heat-resistant resin optical material and film | TOSOH CORPORATION (JP) | 2004-04-01 | — | — | US | claimed |
| EP-1403297-A1 | Transparent heat-resistant resin optical material and film | Tosoh Corporation (JP) | 2004-03-31 | — | — | EP | claimed |
| US-5760120-A | MOLDING MATERIALS, IMPACT RESISTANCE, RUBBER REINFORCED RESIN, TITANIUM BLACK, BLACK IRON OXIDE, YELLOW IRON OXIDE | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1998-06-02 | — | — | US | claimed |