SCHEMBL3314432

SCHEMBL3314432

O=[C]Nn1ccnc1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28282457 0.76
SCHEMBL7262114 0.71 NFKB1 (0.41)
SCHEMBL2447081 0.69
SCHEMBL5087445 0.67
SCHEMBL16542717 0.67
SCHEMBL2840228 0.67
SCHEMBL2840229 0.67
SCHEMBL28486037 0.67
SCHEMBL28442313 0.67
SCHEMBL11067549 0.67 ALDH1A1 (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11597817-B2 Thermoplastic resin composition, method of producing thermoplastic resin composition, molded article of cellulose-reinforced resin, and method of producing molded article of cellulose-reinforced resin FURUKAWA ELECTRIC CO., LTD (JP) 2023-03-07 US disclosed
US-11597818-B2 Molded article FURUKAWA ELECTRIC CO., LTD. (JP) 2023-03-07 US disclosed
EP-3438186-B1 THERMOPLASTIC RESIN COMPOSITION, THERMOPLASTIC RESIN COMPOSITION PRODUCTION METHOD, CELLULOSE-REINFORCED RESIN MOLDED PRODUCT, AND CELLULOSE-REINFORCED RESIN MOLDED PRODUCT MANUFACTURING METHOD FURUKAWA ELECTRIC CO LTD (JP) 2023-02-22 EP disclosed
EP-3438207-B1 THERMOPLASTIC RESIN COMPOSITION, THERMOPLASTIC RESIN COMPOSITION PRODUCTION METHOD, CELLULOSE-REINFORCED RESIN MOLDED PRODUCT, AND CELLULOSE-REINFORCED RESIN MOLDED PRODUCT MANUFACTURING METHOD FURUKAWA ELECTRIC CO LTD (JP) 2023-02-15 EP disclosed
US-11578192-B2 Molded article FURUKAWA ELECTRIC CO., LTD. (JP) 2023-02-14 US disclosed
US-11530316-B2 2022-12-20 US disclosed
EP-3689974-A1 MOLDED ARTICLE Furukawa Electric Co., Ltd. (JP) 2020-08-05 EP disclosed
EP-3689972-A1 MOLDED ARTICLE Furukawa Electric Co., Ltd. (JP) 2020-08-05 EP disclosed
US-20200224008-A1 MOLDED ARTICLE FURUKAWA ELECTRIC CO., LTD. (JP) 2020-07-16 US disclosed
US-20200224007-A1 MOLDED ARTICLE FURUKAWA ELECTRIC CO., LTD. (JP) 2020-07-16 US disclosed
EP-3438207-A1 THERMOPLASTIC RESIN COMPOSITION, THERMOPLASTIC RESIN COMPOSITION PRODUCTION METHOD, CELLULOSE-REINFORCED RESIN MOLDED PRODUCT, AND CELLULOSE-REINFORCED RESIN MOLDED PRODUCT MANUFACTURING METHOD Furukawa Electric Co., Ltd. (JP) 2019-02-06 EP disclosed
EP-3438186-A1 THERMOPLASTIC RESIN COMPOSITION, THERMOPLASTIC RESIN COMPOSITION PRODUCTION METHOD, CELLULOSE-REINFORCED RESIN MOLDED PRODUCT, AND CELLULOSE-REINFORCED RESIN MOLDED PRODUCT MANUFACTURING METHOD Furukawa Electric Co., Ltd. (JP) 2019-02-06 EP disclosed
US-20190031858-A1 THERMOPLASTIC RESIN COMPOSITION, METHOD OF PRODUCING THERMOPLASTIC RESIN COMPOSITION, MOLDED ARTICLE OF CELLULOSE-REINFORCED RESIN, AND METHOD OF PRODUCING MOLDED ARTICLE OF CELLULOSE-REINFORCED RESIN FURUKAWA ELECTRIC CO., LTD. (JP) 2019-01-31 US disclosed
US-20190023877-A1 THERMOPLASTIC RESIN COMPOSITION, METHOD OF PRODUCING THERMOPLASTIC RESIN COMPOSITION, MOLDED ARTICLE OF CELLULOSE-REINFORCED RESIN, AND METHOD OF PRODUCING MOLDED ARTICLE OF CELLULOSE-REINFORCED RESIN FURUKAWA ELECTRIC CO., LTD. (JP) 2019-01-24 US disclosed
CN-103608010-A Substituted 2-hydroxy-4-(2-(phenylsulfonamido)acetamido)benzoic acid analogs as inhibitors of STAT proteins UNIV CENTRAL FLORIDA RES FOUND 2014-02-26 CN disclosed
US-8394935-B2 Method for producing furanose derivative API CORPORATION (JP) 2013-03-12 US disclosed
US-20100105890-A1 METHOD FOR PRODUCING FURANOSE DERIVATIVE API CORPORATION (JP) 2010-04-29 US disclosed
EP-2105445-A1 METHOD FOR PRODUCTION OF FURANOSE DERIVATIVE API Corporation (JP) 2009-09-30 EP disclosed
CN-100515504-C Coating, coated body and method for producing same INFRAMAT CORP (US) 2009-07-22 CN disclosed
US-5652088-A Silver halide photographic material FUJI PHOTO FILM CO., LTD. (JP) 1997-07-29 US disclosed