Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3326345 | 0.79 | TSHR (0.33) | TSHRTDP1 | |
| SCHEMBL3327914 | 0.74 | TSHR (0.30) | TSHRTDP1 | |
| SCHEMBL14244290 | 0.70 | TSHR (0.67) | TSHRTDP1 | |
| SCHEMBL3326747 | 0.70 | — | — | |
| SCHEMBL28427629 | 0.67 | TSHR (0.61) | TSHRTDP1 | |
| SCHEMBL1717775 | 0.67 | TSHR (0.40) | TSHRTDP1 | |
| SCHEMBL3326170 | 0.67 | DNM1 (0.32) | — | |
| SCHEMBL1717892 | 0.65 | — | — | |
| SCHEMBL28812440 | 0.65 | TSHR (0.38) | TSHRTDP1 | |
| SCHEMBL62399 | 0.65 | TSHR (0.38) | TSHRTDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8716401-B2 | Semiconductor chip laminate and adhesive composition for semiconductor chip lamination | LINTEC CORPORATION (JP) | 2014-05-06 | — | — | US | disclosed |
| US-20100133703-A1 | Semiconductor Chip Laminate and Adhesive Composition for Semiconductor Chip Lamination | LINTEC CORPORATION (JP) | 2010-06-03 | — | — | US | disclosed |
| US-6649728-B2 | Polymerization catalysts or curing agents comprising phosphorus compounds such as tetraethylphosphonium tetrafluoroborate, used improve storage stability coating mixtures | NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) | 2003-11-18 | — | — | US | disclosed |
| US-20030109378-A1 | Catalyst for curing epoxy resins, method for making the same, epoxy resin composition, and powder coating composition | NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) | 2003-06-12 | — | — | US | disclosed |