⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30340733 | 0.82 | — | — | |
| SCHEMBL12475813 | 0.80 | — | — | |
| Water SCHEMBL1116243 | 0.77 | — | — | |
| SCHEMBL3327750 | 0.75 | — | — | |
| SCHEMBL1719585 | 0.71 | ALDH1A1 (0.30) | — | |
| Isobutane SCHEMBL28943382 | 0.71 | ALDH1A1 (0.30) | — | |
| SCHEMBL3327463 | 0.70 | TSHR (0.32) | — | |
| SCHEMBL1717892 | 0.69 | — | — | |
| SCHEMBL1718325 | 0.69 | — | — | |
| Tert-Butanol SCHEMBL384629 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8716401-B2 | Semiconductor chip laminate and adhesive composition for semiconductor chip lamination | LINTEC CORPORATION (JP) | 2014-05-06 | — | — | US | disclosed |
| US-20100133703-A1 | Semiconductor Chip Laminate and Adhesive Composition for Semiconductor Chip Lamination | LINTEC CORPORATION (JP) | 2010-06-03 | — | — | US | disclosed |
| US-6649728-B2 | Polymerization catalysts or curing agents comprising phosphorus compounds such as tetraethylphosphonium tetrafluoroborate, used improve storage stability coating mixtures | NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) | 2003-11-18 | — | — | US | disclosed |
| US-20030109378-A1 | Catalyst for curing epoxy resins, method for making the same, epoxy resin composition, and powder coating composition | NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) | 2003-06-12 | — | — | US | disclosed |