SCHEMBL332874

SCHEMBL332874

C=C(CC(C)C12CC3CC(CC(C3)C1)C2)C(=O)O

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
EPHX2 P34913 6/20 0.43
NPC1 O15118 1/20 0.41
ALDH1A1 P00352 1/20 0.41
MEN1 O00255 1/20 0.39
KMT2A Q03164 1/20 0.39
SLC22A2 O15244 1/20 0.38
SLC47A1 Q96FL8 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.37
TET2 Q6N021 3/20 0.37
TET3 O43151 1/20 0.37
TET1 Q8NFU7 1/20 0.37
MAPT P10636 1/20 0.37
POLB P06746 1/20 0.36
CYP3A4 P08684 1/20 0.36
GAA P10253 1/20 0.36
CYP2C19 P33261 1/20 0.36
GRIK1 P39086 1/20 0.36
GRIK2 Q13002 1/20 0.36
GRM1 Q13255 1/20 0.36
GRM2 Q14416 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5412692 0.85 DPP4 (0.41) EPHX2ALDH1A1CYP3A4
SCHEMBL5419569 0.84 ALDH1A1 (0.42) EPHX2NPC1ALDH1A1KMT2APOLB
SCHEMBL8097536 0.82 ALDH1A1 (0.46) EPHX2NPC1ALDH1A1MEN1KMT2A
SCHEMBL14673444 0.73 ALDH1A1 (0.44) EPHX2NPC1ALDH1A1MEN1KMT2A
Methacrylic Acid SCHEMBL12803308 0.73 ALDH1A1 (0.44) EPHX2NPC1ALDH1A1MEN1KMT2A
SCHEMBL3674042 0.71 ALDH1A1 (0.43) EPHX2NPC1ALDH1A1MEN1KMT2A
SCHEMBL2390569 0.69 EPHX2 (0.40) EPHX2NPC1ALDH1A1MEN1KMT2A
SCHEMBL5901412 0.69 TSHR (0.51) EPHX2NPC1ALDH1A1MEN1KMT2A
SCHEMBL14695859 0.69 SLC22A2 (0.50) EPHX2NPC1ALDH1A1MEN1KMT2A
SCHEMBL704030 0.68 ALDH1A1 (0.50) EPHX2ALDH1A1MEN1KMT2ASMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8859187-B2 Method of forming resist pattern and negative resist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2014-10-14 US disclosed
EP-1895576-B1 PATTERN FORMING METHOD TOKYO OHKA KOGYO CO LTD (JP) 2014-07-23 EP disclosed
EP-1590709-B1 PROCESS FOR REFINING CRUDE RESIN FOR RESIST TOKYO OHKA KOGYO CO LTD (JP) 2013-04-03 EP disclosed
US-8349543-B2 Pattern-forming method, metal oxide film-forming material and method for using the metal oxide film-forming material TOKYO OHKA KOGYO CO. LTD. (JP) 2013-01-08 US disclosed
US-8101013-B2 Film-forming material and method of forming pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2012-01-24 US disclosed
US-8097396-B2 Reduced defects; improved shape and stability of latent image; comprised of acrylate copolymer having lactone ring and polycyclic ring containing monomers; increased alkali solubility under action of acid generator upon exposure TOKYO OHKA KOGYO CO., LTD. (JP) 2012-01-17 US disclosed
US-8043795-B2 Method of forming resist pattern TOKYO OHIKA KOGYO CO., LTD. (JP) 2011-10-25 US disclosed
US-8025923-B2 Method for manufacturing a structure TOKYO OHKA KOGYO CO., LTD. (JP) 2011-09-27 US disclosed
US-7932013-B2 Pattern coating material and pattern forming method TOKYO OHKA KOGYO CO., LTD. (JP) 2011-04-26 US disclosed
US-7767378-B2 Mixing a blend of copolymers of identical structural units but have mutually different measured values for a contact angle; mixing conditions for plurality of copolymers are adjusted so that a measured value of a contact angle for said resist composition is no higher than 40 degrees to avoid defects TOKYO OHKA KOGYO CO., LTD. (JP) 2010-08-03 US disclosed
US-20090042129-A1 POSITIVE RESIST COMPOSITION AND METHOD FOR RESIST PATTERN FORMATION TOKYO OHKA KOGYO CO., LTD. (JP) 2009-02-12 US disclosed
US-20090029288-A1 METHOD FOR PRODUCING RESIST COMPOSITION AND RESIST COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2009-01-29 US disclosed
US-20090029284-A1 PATTERN COATING MATERIAL AND PATTERN FORMING METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2009-01-29 US disclosed
WO-2008066306-A1 NORBORNENE POLYMER OR COPOLYMER AND METHOD OF PREPARING THE SAME KOLON INDUSTRIES, INC. (KR) 2008-06-05 WO disclosed
US-20080063974-A1 Positive Resist Composition and Method for Forming Resist Pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2008-03-13 US disclosed
EP-1895576-A1 PATTERN COATING MATERIAL AND PATTERN FORMING METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2008-03-05 EP disclosed
US-7276575-B2 Process for refining crude resin for resist TOKYO OHKA KOGYO CO., LTD. (JP) 2007-10-02 US disclosed
WO-2007100223-A1 NORBORNENE-ESTER POLYMER CONTAINING BULKY SUBSTITUENTS KOLON INDUSTRIES, INC. (KR) 2007-09-07 WO disclosed
EP-1813990-A1 METHOD FOR FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2007-08-01 EP disclosed
US-20060135745-A1 Process for refining crude resin for resist TOKYO OHKA KOGYO CO., LTD. (JP) 2006-06-22 US disclosed