⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3467583 | 1.00 | ALDH1A1 (0.44) | — | |
| SCHEMBL28919756 | 0.97 | — | — | |
| SCHEMBL2114536 | 0.90 | — | — | |
| SCHEMBL2515564 | 0.83 | ALDH1A1 (0.55) | — | |
| SCHEMBL17167087 | 0.83 | ALDH1A1 (0.55) | — | |
| SCHEMBL851363 | 0.83 | ALDH1A1 (0.55) | — | |
| SCHEMBL2516058 | 0.83 | ALDH1A1 (0.55) | — | |
| SCHEMBL2513750 | 0.83 | ALDH1A1 (0.55) | — | |
| SCHEMBL345679 | 0.83 | ALDH1A1 (0.55) | — | |
| SCHEMBL310641 | 0.83 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 73 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116075368-B | Resin composition, cured product, method for producing same, and laminate | 三菱化学株式会社 | 2024-06-11 | — | — | CN | disclosed |
| US-11912889-B2 | Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-02-27 | — | — | US | disclosed |
| US-20230257503-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | MITSUBISHI CHEMICAL CORPORATION (JP) | 2023-08-17 | — | — | US | disclosed |
| EP-4212256-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | Mitsubishi Chemical Corporation (JP) | 2023-07-19 | — | — | EP | disclosed |
| CN-116075368-A | Resin composition, cured product, method for producing same, and laminate | 三菱化学株式会社 | 2023-05-05 | — | — | CN | disclosed |
| US-11542397-B2 | Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-01-03 | — | — | US | disclosed |
| US-11413682-B2 | Method for producing surface-modified metal oxide fine particle, method for producing improved metal oxide fine particles, surface-modified metal oxide fine particles, and metal oxide fine particle dispersion liquid | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-08-16 | — | — | US | disclosed |
| CN-110249004-B | Polyimide precursor composition | 东京应化工业株式会社 | 2022-07-19 | — | — | CN | disclosed |
| US-20220220338-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-14 | — | — | US | disclosed |
| US-20220213348-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-07 | — | — | US | disclosed |
| EP-2800154-A1 | SEALANT FOR LED DEVICE, LED DEVICE, AND METHOD FOR PRODUCING LED DEVICE | Konica Minolta, Inc. (JP) | 2014-11-05 | — | — | EP | disclosed |
| EP-2752898-A1 | PHOSPHOR DISPERSION LIQUID, AND PRODUCTION METHOD FOR LED DEVICE USING SAME | Konica Minolta, Inc. (JP) | 2014-07-09 | — | — | EP | disclosed |
| EP-2472655-B1 | Negative electrode base member | TOKYO OHKA KOGYO CO LTD (JP) | 2014-03-12 | — | — | EP | disclosed |
| US-8551651-B2 | Secondary cell having negative electrode base member | TOKYO OHKA KOGYO CO., LTD. (JP) | 2013-10-08 | — | — | US | disclosed |
| US-20130252099-A1 | NEGATIVE ELECTRODE BASE MEMBER | KANTO GAKUIN UNIVERSITY SURFACE ENGINEERING RESEARCH INSTITUTE (JP) | 2013-09-26 | — | — | US | disclosed |
| US-20130252098-A1 | NEGATIVE ELECTRODE BASE MEMBER | KANTO GAKUIN UNIVERSITY SURFACE ENGINEERING RESEARCH INSTITUTE (JP) | 2013-09-26 | — | — | US | disclosed |
| EP-2472655-A1 | Negative electrode base member | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2012-07-04 | — | — | EP | disclosed |
| US-20100119939-A1 | NEGATIVE ELECTRODE BASE MEMBER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2010-05-13 | — | — | US | disclosed |
| EP-2131423-A1 | NEGATIVE ELECTRODE BASE MEMBER | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2009-12-09 | — | — | EP | disclosed |
| US-20080318165-A1 | Composition For Forming Antireflective Film And Wiring Forming Method Using Same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-12-25 | — | — | US | disclosed |