⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28919756 | 0.93 | — | — | |
| SCHEMBL3467583 | 0.90 | ALDH1A1 (0.44) | — | |
| SCHEMBL3329182 | 0.90 | — | — | |
| SCHEMBL2114053 | 0.83 | CA2 (0.33) | — | |
| SCHEMBL5522 | 0.82 | — | — | |
| SCHEMBL27715224 | 0.82 | — | — | |
| SCHEMBL1608669 | 0.81 | MEN1 (0.33) | — | |
| SCHEMBL111154 | 0.79 | — | — | |
| SCHEMBL23295171 | 0.78 | — | — | |
| Water SCHEMBL28124261 | 0.78 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 161 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111910443-A | Graphene antibacterial coating and preparation method thereof | 苏州世韩纺织整理有限公司 | 2020-11-10 | — | — | CN | claimed |
| EP-4703405-A1 | CRYSTALLINE POLYOXYALKYLENE-BASED POLYMER AND CURABLE COMPOSITION COMPRISING SAME | Kaneka Corporation (JP) | 2026-03-04 | — | — | EP | disclosed |
| EP-3950832-B1 | CURABLE COMPOSITION AND CURED PRODUCT | KANEKA CORP (JP) | 2025-10-22 | — | — | EP | disclosed |
| EP-3889206-B1 | POLYOXYALKYLENE POLYMER AND CURABLE COMPOSITION | KANEKA CORP (JP) | 2025-10-15 | — | — | EP | disclosed |
| EP-4596622-A1 | CURABLE COMPOSITION | Kaneka Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| US-12378406-B2 | Mixture of polyoxyalkylene polymers and curable composition | KANEKA CORPORATION (JP) | 2025-08-05 | — | — | US | disclosed |
| CN-120091905-A | Method for producing one or more topographical structures and plastic substrate | 卡尔蔡司光学国际有限公司 | 2025-06-03 | — | — | CN | disclosed |
| EP-4105262-B1 | CURABLE COMPOSITION AND CURED PRODUCT THEREOF | KANEKA CORP (JP) | 2025-04-02 | — | — | EP | disclosed |
| US-12234322-B2 | Polyoxyalkylene polymer and curable composition | KANEKA CORPORATION (JP) | 2025-02-25 | — | — | US | disclosed |
| CN-116406451-B | Method for manufacturing an ophthalmic lens | 卡尔蔡司光学国际有限公司 | 2024-12-13 | — | — | CN | disclosed |
| US-20060141693-A1 | Semiconductor multilayer interconnection forming method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-06-29 | — | — | US | disclosed |
| EP-1641908-A1 | CLEANING COMPOSITION, METHOD OF CLEANING SEMICONDUCTOR SUBSTRATE, AND METHOD OF FORMING WIRING ON SEMICONDUCTOR SUBSTRATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-04-05 | — | — | EP | disclosed |
| EP-1566836-A1 | SEMICONDUCTOR MULTILAYER INTERCONNECTION FORMING METHOD | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-08-24 | — | — | EP | disclosed |
| US-20050112383-A1 | Undercoating layer material for lithography and wiring forming method using the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-05-26 | — | — | US | disclosed |
| US-20050074695-A1 | Undercoating material for wiring, embedded material, and wiring formation method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-04-07 | — | — | US | disclosed |
| WO-2004113486-A1 | CLEANING COMPOSITION, METHOD OF CLEANING SEMICONDUCTOR SUBSTRATE, AND METHOD OF FORMING WIRING ON SEMICONDUCTOR SUBSTRATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2004-12-29 | — | — | WO | disclosed |
| US-20040259761-A1 | Cleaning composition, method of cleaning semiconductor substrate, and method of forming wiring on semiconductor substrate | TOKYO OHKA KOGYO CO., LTD. INTEL CORPORATION | 2004-12-23 | — | — | US | disclosed |
| US-20040121937-A1 | Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith | TOKYO OHKA KOGYO CO., LTD. (JP) | 2004-06-24 | — | — | US | disclosed |
| US-6515073-B2 | Comprising di-, tri- and/or tetra-(alkoxy/phenoxy)silanes and a thermosetting resin which can be condensed therewith which has an absorption capacity with respect to exposing light; can be etched at high rate for fine resist patterns | TOKYO OHKA KOGYO CO., LTD. (JP) | 2003-02-04 | — | — | US | disclosed |
| US-20010036998-A1 | Anti-reflective coating-forming composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-11-01 | — | — | US | disclosed |