Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DNM1 | Q05193 | 2/20 | 0.57 |
| ▸ | BDKRB2 | P30411 | 3/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
| ▸ | TSHR | P16473 | 4/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.32 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.32 |
| ▸ | FDPS | P14324 | 1/20 | 0.32 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | CA2 | P00918 | 2/20 | 0.31 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.31 |
| ▸ | OPRM1 | P35372 | 1/20 | 0.31 |
| ▸ | CA1 | P00915 | 1/20 | 0.30 |
| ▸ | THRB | P10828 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL161505 | 0.94 | DNM1 (0.63) | DNM1BDKRB2ALDH1A1TDP1TSHR | |
| SCHEMBL4523126 | 0.90 | DNM1 (0.67) | DNM1BDKRB2TSHRFDPSLMNA | |
| SCHEMBL4525937 | 0.90 | DNM1 (0.67) | DNM1BDKRB2TSHRFDPSLMNA | |
| SCHEMBL4535075 | 0.90 | DNM1 (0.67) | DNM1BDKRB2TSHRFDPSLMNA | |
| SCHEMBL4523439 | 0.90 | DNM1 (0.67) | DNM1BDKRB2TSHRFDPSLMNA | |
| SCHEMBL4520963 | 0.90 | DNM1 (0.67) | DNM1BDKRB2TSHRFDPSLMNA | |
| SCHEMBL3325532 | 0.89 | DNM1 (0.74) | DNM1BDKRB2ALDH1A1TDP1TSHR | |
| SCHEMBL3327253 | 0.89 | DNM1 (0.74) | DNM1BDKRB2ALDH1A1TDP1TSHR | |
| SCHEMBL31499278 | 0.88 | DNM1 (0.71) | DNM1BDKRB2ALDH1A1TDP1TSHR | |
| SCHEMBL1717722 | 0.88 | DNM1 (0.38) | DNM1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8716401-B2 | Semiconductor chip laminate and adhesive composition for semiconductor chip lamination | LINTEC CORPORATION (JP) | 2014-05-06 | — | — | US | disclosed |
| US-20100133703-A1 | Semiconductor Chip Laminate and Adhesive Composition for Semiconductor Chip Lamination | LINTEC CORPORATION (JP) | 2010-06-03 | — | — | US | disclosed |
| US-6649728-B2 | Polymerization catalysts or curing agents comprising phosphorus compounds such as tetraethylphosphonium tetrafluoroborate, used improve storage stability coating mixtures | NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) | 2003-11-18 | — | — | US | disclosed |
| US-20030109378-A1 | Catalyst for curing epoxy resins, method for making the same, epoxy resin composition, and powder coating composition | NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) | 2003-06-12 | — | — | US | disclosed |