SCHEMBL3334537

SCHEMBL3334537

OC1CCC2CCC(O)CC2C1

nearest known ligand 0.35

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
LMNA P02545 1/20 0.35
CYP2C9 P11712 1/20 0.35
TSHR P16473 1/20 0.33
ADRA2A P08913 2/20 0.31
ADRA2B P18089 2/20 0.31
ADRA2C P18825 2/20 0.31
ADRA1D P25100 2/20 0.31
ADRA1A P35348 2/20 0.31
ADRA1B P35368 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6840454 0.93
SCHEMBL18030980 0.90 LMNA (0.33) LMNACYP2C9TSHRADRA2AADRA2B
SCHEMBL820161 0.89 CYP2C9 (0.36) LMNACYP2C9TSHR
SCHEMBL4569171 0.87 TSHR (0.37) LMNACYP2C9TSHR
SCHEMBL14159019 0.86 TSHR (0.41) TSHR
SCHEMBL9035146 0.84 ALDH1A1 (0.47) LMNACYP2C9TSHR
SCHEMBL17951347 0.84 ALDH1A1 (0.47) LMNACYP2C9TSHR
SCHEMBL527305 0.84 ALDH1A1 (0.47) LMNACYP2C9TSHR
SCHEMBL9909854 0.84 ALDH1A1 (0.39) LMNACYP2C9TSHR
SCHEMBL3372644 0.84 ALDH1A1 (0.47) LMNACYP2C9TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 65 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119161847-B Polyurethane structural adhesive 杭州得力科技股份有限公司 2025-04-04 CN claimed
CN-119161847-A Polyurethane structural adhesive 杭州得力科技股份有限公司 2024-12-20 CN claimed
CN-112409845-A Printing ink TCL集团股份有限公司 2021-02-26 CN claimed
CN-119161847-B Polyurethane structural adhesive 杭州得力科技股份有限公司 2025-04-04 CN disclosed
CN-119161847-A Polyurethane structural adhesive 杭州得力科技股份有限公司 2024-12-20 CN disclosed
CN-112552627-B Polymeric film and laminate comprising same 长春石油化学股份有限公司 2023-04-14 CN disclosed
CN-115667418-A Thermosetting polymer powder 毕克化学有限公司 2023-01-31 CN disclosed
CN-114846032-A Radical polymerizable resin composition and cured product thereof 昭和电工株式会社 2022-08-02 CN disclosed
CN-114829432-A Radical polymerizable resin composition and cured product thereof 昭和电工株式会社 2022-07-29 CN disclosed
CN-114685745-A Urethane (meth) acrylate and method for producing urethane (meth) acrylate resin 昭和电工株式会社 2022-07-01 CN disclosed
CN-109071777-B Composition for carbon fiber-reinforced resin, carbon fiber-reinforced resin composition, and cured product 昭和电工株式会社 2022-06-10 CN disclosed
EP-0632058-A1 Polymer scale preventive agent SHIN-ETSU CHEMICAL CO., LTD. (JP) 1995-01-04 EP disclosed
EP-0197458-B1 CURABLE EPOXY RESIN COMPOSITION ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 1991-11-06 EP disclosed
US-4689390-A AMINE-EPOXY ADDUCT REACTED WITH PHENOLIC RESIN, ONE-PACK ASAHI DENKA KOGYO K.K. (JP) 1987-08-25 US disclosed
US-4657947-A COVERING RUSTY METAL SURFACES ASAHI DENKA KOGYO K.K. (JP) 1987-04-14 US disclosed
US-4657953-A CORROSION RESISTANCE ASAHI DENKA KOGYO K.K. (JP) 1987-04-14 US disclosed
US-4535103-A POLYEPOXIDES AND EPOXY RESINS CROSSLINKED AND HARDENED WITH PHOSPHOROUS COMPOUNDS, AMINES, AND DIISOCYANATES ASAHI DENKA KOGYO K.K. (JP) 1985-08-13 US disclosed
US-4530947-A A RUSTY METAL-ADHERING CURABLE MIXTURE OF EPOXIDE-POLYHYDROXIDE REACTION PRODUCT, POLYISOCYANATE AND BITUMINOUS MATERIAL ASAHI DENKA KOGYO K.K. (JP) 1985-07-23 US disclosed
US-4340716-A EPOXY RESINS AND HARDENERS ASAHI DENKA KOGYO K.K. (JP) 1982-07-20 US disclosed
US-3950451-A COUPLED PRODUCT OF ALKYLPHENOL AND PHENOL-FORMALDEHYDE-DIAMINE CONDENSATE ASAHI DENKA KOGYO K.K. (JA) 1976-04-13 US disclosed