Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CES2 | O00748 | 3/20 | 0.50 |
| ▸ | CES1 | P23141 | 3/20 | 0.50 |
| ▸ | GPR84 | Q9NQS5 | 7/20 | 0.48 |
| ▸ | PPARG | P37231 | 7/20 | 0.48 |
| ▸ | PPARD | Q03181 | 7/20 | 0.48 |
| ▸ | PPARA | Q07869 | 7/20 | 0.48 |
| ▸ | HDAC11 | Q96DB2 | 5/20 | 0.48 |
| ▸ | TSHR | P16473 | 5/20 | 0.48 |
| ▸ | PTPN1 | P18031 | 3/20 | 0.48 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.48 |
| ▸ | TLR2 | O60603 | 2/20 | 0.48 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.48 |
| ▸ | FABP4 | P15090 | 2/20 | 0.48 |
| ▸ | SLC22A6 | Q4U2R8 | 1/20 | 0.48 |
| ▸ | SLC22A8 | Q8TCC7 | 1/20 | 0.48 |
| ▸ | MEN1 | O00255 | 1/20 | 0.48 |
| ▸ | ESR1 | P03372 | 1/20 | 0.48 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.48 |
| ▸ | PDE4A | P27815 | 1/20 | 0.48 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11414513 | 1.00 | CES2 (0.50) | CES2CES1GPR84PPARGPPARD | |
| SCHEMBL11246688 | 1.00 | CES2 (0.50) | CES2CES1GPR84PPARGPPARD | |
| SCHEMBL11797828 | 1.00 | CES2 (0.50) | CES2CES1GPR84PPARGPPARD | |
| Ammonia Solution, Strong SCHEMBL28183004 | 0.97 | CES2 (0.48) | CES2CES1GPR84PPARGPPARD | |
| SCHEMBL906530 | 0.97 | CES2 (0.52) | CES2CES1GPR84PPARGPPARD | |
| SCHEMBL418280 | 0.97 | CES2 (0.52) | CES2CES1GPR84PPARGPPARD | |
| SCHEMBL115903 | 0.97 | CES2 (0.52) | CES2CES1GPR84PPARGPPARD | |
| SCHEMBL11596235 | 0.97 | CES2 (0.52) | CES2CES1GPR84PPARGPPARD | |
| SCHEMBL10693208 | 0.97 | CES2 (0.52) | CES2CES1GPR84PPARGPPARD | |
| SCHEMBL2281929 | 0.97 | CES2 (0.52) | CES2CES1GPR84PPARGPPARD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118302485-A | Resin composition | 日产化学株式会社 | 2024-07-05 | — | — | CN | disclosed |
| CN-117099046-A | Photosensitive resin composition for forming insulating film | 日产化学株式会社 | 2023-11-21 | — | — | CN | disclosed |
| WO-2023176259-A1 | PHOTOSENSITIVE RESIN COMPOSITION FOR FORMING INSULATING FILM | 日産化学株式会社 | 2023-09-21 | — | — | WO | disclosed |
| WO-2023106101-A1 | RESIN COMPOSITION | 日産化学株式会社 | 2023-06-15 | — | — | WO | disclosed |
| WO-2023106108-A1 | PHOTOSENSITIVE RESIN COMPOSITION | 日産化学株式会社 | 2023-06-15 | — | — | WO | disclosed |
| US-11643544-B2 | Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same | TAIWAN UNION TECHNOLOGY CORPORATION (TW) | 2023-05-09 | — | — | US | disclosed |
| CN-108349919-B | Polyfunctional epoxy compound and curable composition containing the same | 日产化学工业株式会社 | 2022-06-03 | — | — | CN | disclosed |
| CN-110117404-B | Resin composition, and prepreg, metal foil laminate and printed wiring board produced using the same | 台燿科技股份有限公司 | 2021-12-07 | — | — | CN | disclosed |
| CN-109843965-B | Epoxy resin composition for forming printed wiring board | 日产化学株式会社 | 2021-07-27 | — | — | CN | disclosed |
| CN-108350252-B | Epoxy reactive diluent and epoxy resin composition containing same | 日产化学工业株式会社 | 2021-04-09 | — | — | CN | disclosed |
| US-20200347226-A1 | RESIN COMPOSITION FOR INSULATING FILM | NISSAN CHEMICAL CORPORATION (JP) | 2020-11-05 | — | — | US | disclosed |
| CN-111566144-A | Resin composition for insulating film | 日产化学株式会社 | 2020-08-21 | — | — | CN | disclosed |
| US-20200209745-A1 | PHOTOSENSITIVE RESIN COMPOSITION | NISSAN CHEMICAL CORPORATION (JP) | 2020-07-02 | — | — | US | disclosed |
| CN-111316165-A | Photosensitive resin composition | 日产化学株式会社 | 2020-06-19 | — | — | CN | disclosed |
| CN-110662740-A | Method for producing epoxy compound | 日产化学株式会社 | 2020-01-07 | — | — | CN | disclosed |
| US-20190241733-A1 | RESIN COMPOSITION, AND PREPREG, METAL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD PREPARED USING THE SAME | TAIWAN UNION TECHNOLOGY CORPORATION (TW) | 2019-08-08 | — | — | US | disclosed |
| US-20100143273-A1 | COSMETIC COMPOSITION COMPRISING AT LEAST ONE APROTIC HYDROCARBON-BASED VOLATILE SOLVENT | L'OREAL S.A. (FR) | 2010-06-10 | — | — | US | disclosed |
| EP-2083789-A1 | COSMETIC COMPOSITION COMPRISING AT LEAST ONE APROTIC HYDROCARBON-BASED VOLATILE SOLVENT | L'Oréal (FR) | 2009-08-05 | — | — | EP | disclosed |
| WO-2008061985-A1 | COSMETIC COMPOSITION COMPRISING AT LEAST ONE APROTIC HYDROCARBON-BASED VOLATILE SOLVENT | L'OREAL (FR) | 2008-05-29 | — | — | WO | disclosed |