SCHEMBL3337693

SCHEMBL3337693

[O-][S+](c1cccc(O)c1O)c1cccc(O)c1O

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.52
HPGD P15428 4/20 0.52
ALOX15 P16050 4/20 0.52
HSD17B10 Q99714 4/20 0.52
CA2 P00918 4/20 0.52
LMNA P02545 3/20 0.52
RECQL P46063 3/20 0.52
TDP1 Q9NUW8 3/20 0.52
EGFR P00533 2/20 0.52
FYN P06241 2/20 0.52
MMP9 P14780 2/20 0.52
CDK2 P24941 2/20 0.52
CA1 P00915 2/20 0.52
ADAMTS4 O75173 1/20 0.52
MMP2 P08253 1/20 0.52
MMP8 P22894 1/20 0.52
CA6 P23280 1/20 0.52
MMP12 P39900 1/20 0.52
ADAMTS5 Q9UNA0 1/20 0.52
TRPA1 O75762 2/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29904876 1.00 ALDH1A1 (0.52) ALDH1A1HPGDALOX15HSD17B10CA2
SCHEMBL5329574 0.85 ALDH1A1 (0.52) ALDH1A1HPGDALOX15HSD17B10CA2
SCHEMBL1644688 0.85 ALDH1A1 (0.42) ALDH1A1HPGDALOX15HSD17B10CA2
SCHEMBL29646229 0.84 ALDH1A1 (0.47) ALDH1A1HPGDALOX15HSD17B10CA2
SCHEMBL18337 0.84 ALDH1A1 (0.47) ALDH1A1HPGDALOX15HSD17B10CA2
SCHEMBL11322501 0.82 ALDH1A1 (0.45) ALDH1A1HPGDALOX15HSD17B10CA2
SCHEMBL5372734 0.77 SELL (0.36) ALDH1A1HPGDALOX15HSD17B10CA2
SCHEMBL30678709 0.77 SELL (0.36) ALDH1A1HPGDALOX15HSD17B10CA2
SCHEMBL8520822 0.75 ALDH1A1 (0.52) ALDH1A1HPGDALOX15HSD17B10CA2
Pyrogallol SCHEMBL1042997 0.74 ALDH1A1 (0.92) ALDH1A1HPGDALOX15HSD17B10CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 64 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024141400-A1 COMPOSITION FOR SELECTIVELY REMOVING OXIDE COMPOUNDS AND ETCHING RESIDUES OF ONE OR BOTH OF CO AND CU BASF SE (DE) 2024-07-04 WO disclosed
US-20240213072-A1 LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING PROCESSED SEMICONDUCTOR SUBSTRATE NISSAN CHEMICAL CORPORATION (JP) 2024-06-27 US disclosed
US-20240199924-A1 LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING PROCESSED SEMICONDUCTOR SUBSTRATE NISSAN CHEMICAL CORPORATION (JP) 2024-06-20 US disclosed
EP-4310157-A1 LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING MACHINED SEMICONDUCTOR SUBSTRATE Nissan Chemical Corporation (JP) 2024-01-24 EP disclosed
EP-4309893-A1 LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE Nissan Chemical Corporation (JP) 2024-01-24 EP disclosed
CN-117157738-A Laminate, stripper composition, and method for producing processed semiconductor substrate 日产化学株式会社 2023-12-01 CN disclosed
CN-117157739-A Laminate, stripper composition, and method for producing processed semiconductor substrate 日产化学株式会社 2023-12-01 CN disclosed
US-10607876-B2 Method for processing mold material and method for manufacturing structural body TOKYO OHKA KOGYO CO., LTD. (JP) 2020-03-31 US disclosed
US-10112377-B2 Supporting member separation method and supporting member separation apparatus TOKYO OHKA KOGYO CO., LTD. (JP) 2018-10-30 US disclosed
EP-2133366-B1 FINE FIBROUS CELLULOSE MATERIAL AND METHOD FOR PRODUCING THE SAME AIST (JP) 2018-02-21 EP disclosed
US-6040367-A EXCELLENT RESISTANCE TO AN IONIZING RADIATION, IN WHICH HETEROCYCLIC COMPOUND CONTAINING OXYMETHYLENE UNITS MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2000-03-21 US disclosed
US-5977206-A Polycarbonate resin composition MITSUBISHI ENGINEERING-PLASTICS CORP. (JP) 1999-11-02 US disclosed
US-5948847-A ACRYLATED ESTER CROSSLINKED WITH NITROGEN CONTAINING ORGANIC COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 1999-09-07 US disclosed
US-5948838-A 0.01 TO 5 PARTS BY WEIGHT OF A COMPOUND CONTAINING OXYMETHYLENE UNIT MITSUBISHI ENGINEERING-PLASTICS CORP. (JP) 1999-09-07 US disclosed
US-5925495-A Photoresist laminate and method for patterning using the same TOKYO OHKA KOGYO CO., LTD. (JP) 1999-07-20 US disclosed
US-5908738-A Undercoating composition for photolithography TOKYO OHKA KOGYO CO., LTD. (JP) 1999-06-01 US disclosed
US-5756255-A Undercoating composition for photolithography TOKYO OHKA KOGYO CO., LTD. (JP) 1998-05-26 US disclosed
EP-0794218-A2 Polycarbonate resin composition stabilized against radiation MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 1997-09-10 EP disclosed
EP-0753540-A2 Polycarbonate resin composition MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 1997-01-15 EP disclosed
US-4101519-A MOLECULAR WEIGHT REDUCTION, TERTIARY AMINE CATALYST GENERAL ELECTRIC COMPANY (US) 1978-07-18 US disclosed