SCHEMBL3337758

SCHEMBL3337758

CC/C=C/[Si](C)(OCC)OCC

nearest known ligand 0.32

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
TRPA1 O75762 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3337761 1.00 TRPA1 (0.32) TRPA1
SCHEMBL17474340 0.83
SCHEMBL17474341 0.83
SCHEMBL8751595 0.80
SCHEMBL927326 0.80 TDP1 (0.32)
SCHEMBL927327 0.80 TDP1 (0.32)
SCHEMBL6358391 0.80
SCHEMBL5808012 0.77 TSHR (0.33)
SCHEMBL5808009 0.77 TSHR (0.33)
SCHEMBL335441 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5651921-A Process for preparing a water repellent silica sol IDEMITSU KOSAN COMPANY LIMITED (JP) 1997-07-29 US claimed
US-20220153583-A1 BULK BORON NITRIDE PARTICLES, THERMALLY CONDUCTIVE RESIN COMPOSITION, AND HEAT DISSIPATING MEMBER DENKA COMPANY LIMITED (JP) 2022-05-19 US disclosed
WO-2020196644-A1 BULK BORON NITRIDE PARTICLES, THERMALLY CONDUCTIVE RESIN COMPOSITION, AND HEAT DISSIPATING MEMBER デンカ株式会社 2020-10-01 WO disclosed
US-8968458-B2 Composition for resist underlayer film and process for producing same JSR CORPORATION (JP) 2015-03-03 US disclosed
US-8808446-B2 Composition for resist underlayer film and process for producing same JSR CORPORATION (JP) 2014-08-19 US disclosed
US-20100151384-A1 COMPOSITION FOR RESIST UNDERLAYER FILM AND PROCESS FOR PRODUCING SAME JSR CORPORATION (JP) 2010-06-17 US disclosed
US-20090050020-A1 COMPOSITION FOR RESIST UNDERLAYER FILM AND PROCESS FOR PRODUCING SAME JSR CORPORATION (JP) 2009-02-26 US disclosed
EP-1855159-A1 COMPOSITION FOR UNDERLAYER FILM OF RESIST AND PROCESS FOR PRODUCING THE SAME JSR Corporation (JP) 2007-11-14 EP disclosed
EP-0475132-B1 Water repellent silica sol and process for preparing the same IDEMITSU KOSAN CO (JP) 1998-06-10 EP disclosed
US-5651921-A Process for preparing a water repellent silica sol IDEMITSU KOSAN COMPANY LIMITED (JP) 1997-07-29 US disclosed
EP-0475132-A1 Water repellent silica sol and process for preparing the same IDEMITSU KOSAN COMPANY LIMITED (JP) 1992-03-18 EP disclosed