SCHEMBL3343039

SCHEMBL3343039

ClCCOc1c2ccccc2nc2ccccc12

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
POLB P06746 3/20 0.52
KDM4E B2RXH2 5/20 0.50
KMT2A Q03164 4/20 0.50
GLA P06280 3/20 0.50
MAPT P10636 2/20 0.50
KCNA3 P22001 1/20 0.48
MAOA P21397 2/20 0.47
MAOB P27338 1/20 0.47
KDM1A O60341 1/20 0.43
ALDH1A1 P00352 4/20 0.42
HPGD P15428 3/20 0.42
CASP1 P29466 2/20 0.42
CASP7 P55210 2/20 0.42
SMN1; SMN2 Q16637 2/20 0.42
HSD17B10 Q99714 2/20 0.42
CHRM2 P08172 1/20 0.42
ADRA2A P08913 1/20 0.42
ADORA3 P0DMS8 1/20 0.42
CHRM1 P11229 1/20 0.42
NQO2 P16083 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11165792 0.83 SMN1; SMN2 (0.40) KDM4EKMT2AMAPTKCNA3ALDH1A1
SCHEMBL3343356 0.81 POLB (0.57) POLBKDM4EKMT2AGLAMAPT
SCHEMBL19583344 0.79 POLB (0.55) POLBKDM4EKMT2AGLAMAPT
SCHEMBL10694110 0.78 L3MBTL1 (0.50) KDM4EKMT2AGLAKCNA3MAOA
SCHEMBL3349292 0.76 POLB (0.61) POLBKDM4EKMT2AGLAMAPT
SCHEMBL29488275 0.76 POLB (0.61) POLBKDM4EKMT2AGLAMAPT
SCHEMBL21694025 0.74 SMN1; SMN2 (0.40) KDM4EMAPTKCNA3ALDH1A1HPGD
SCHEMBL27914444 0.74 PDE5A (0.56) POLBKDM4EKMT2AGLAMAPT
SCHEMBL4957181 0.73 KMT2A (0.46) POLBKDM4EKMT2AGLAMAPT
SCHEMBL17423220 0.72 KDM4E (0.78) POLBKDM4EKMT2AGLAMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110357989-B Tertiary amine photosensitizer, preparation method thereof, photosensitive resin composition containing tertiary amine photosensitizer and application of photosensitive resin composition 常州强力电子新材料股份有限公司 2022-04-22 CN claimed
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US claimed
CN-111315828-B Composition, cured product, optical filter, and method for producing cured product 株式会社艾迪科 2023-09-29 CN disclosed
CN-112154167-B Composition, cured product, optical filter, and method for producing cured product 株式会社艾迪科 2023-08-22 CN disclosed
CN-110114376-B Curable composition, method for producing cured product, cured product thereof, and adhesive using same 株式会社ADEKA 2022-06-14 CN disclosed
CN-110357989-B Tertiary amine photosensitizer, preparation method thereof, photosensitive resin composition containing tertiary amine photosensitizer and application of photosensitive resin composition 常州强力电子新材料股份有限公司 2022-04-22 CN disclosed
EP-3339331-B1 COMPOSITION ADEKA CORP (JP) 2022-02-16 EP disclosed
CN-108419438-B Coloring composition 株式会社艾迪科 2021-10-01 CN disclosed
CN-112154167-A Composition, cured product, optical filter, and method for producing cured product 株式会社艾迪科 2020-12-29 CN disclosed
CN-111566173-A Coating composition, method for curing the composition, barrier film, and method for producing cured product 株式会社艾迪科 2020-08-21 CN disclosed
CN-111221215-A Photosensitive resin composition and application thereof 常州强力先端电子材料有限公司 2020-06-02 CN disclosed
WO-2020021969-A1 COMPOSITION, CURED PRODUCT, OPTICAL FILTER, AND PRODUCTION METHOD FOR CURED PRODUCT 株式会社ADEKA 2020-01-30 WO disclosed
CN-110357989-A Tertiary amine photosensitizer, preparation method, comprising its photosensitive polymer combination and photosensitive polymer combination application 常州强力电子新材料股份有限公司 2019-10-22 CN disclosed
EP-3339331-A1 COMPOSITION Adeka Corporation (JP) 2018-06-27 EP disclosed
CN-102844709-B Photosensitive resin composition, photoresist film using same, method for forming resist pattern, and method for manufacturing printed wiring board NICHIGO MORTON CO LTD 2014-08-20 CN disclosed
CN-102844709-A Photosensitive resin composition, photoresist film using same, method for forming resist pattern, and method for manufacturing printed wiring board NICHIGO MORTON CO LTD 2012-12-26 CN disclosed
US-20100159691-A1 PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE ASAHI KASEI EMD CORPORATION (JP) 2010-06-24 US disclosed
CN-101568882-A Photosensitive resin composition and laminate ASAHI KASEI EMD CORP (JP) 2009-10-28 CN disclosed
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US disclosed