Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29117648 | 0.98 | — | — | |
| SCHEMBL31115228 | 0.96 | TSHR (0.31) | TSHR | |
| SCHEMBL29634458 | 0.86 | — | — | |
| SCHEMBL2775101 | 0.85 | TSHR (0.31) | TSHR | |
| SCHEMBL8736057 | 0.84 | KEAP1 (0.32) | — | |
| SCHEMBL8736061 | 0.84 | KEAP1 (0.32) | — | |
| SCHEMBL28786170 | 0.79 | GSTP1 (0.30) | — | |
| SCHEMBL5689365 | 0.79 | — | — | |
| SCHEMBL14483846 | 0.79 | — | — | |
| SCHEMBL685834 | 0.78 | CYP19A1 (0.37) | TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Appears in 2007 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260109079-A1 | COVERED PANEL AND METHOD FOR MANUFACTURING COVERED PANELS | UNILIN BV (BE) | 2026-04-23 | — | — | US | claimed |
| US-20260109078-A1 | COVERED PANEL AND METHOD FOR MANUFACTURING COVERED PANELS | UNILIN BV (BE) | 2026-04-23 | — | — | US | claimed |
| EP-3954837-B1 | CASTING IN THE SHAPE OF A SINK | SCHOCK GMBH (DE) | 2026-01-28 | — | — | EP | claimed |
| US-12459168-B2 | Casting in the form of a sink | SCHOCK GMBH (DE) | 2025-11-04 | — | — | US | claimed |
| EP-4347552-B1 | METHOD FOR MANUFACTURE OF ISOPHORONEDIAMINE | BASF SE (DE) | 2025-05-21 | — | — | EP | claimed |
| CN-120005507-A | Low-temperature-resistant coating and preparation method and application thereof | 成都拓米双都光电有限公司 | 2025-05-16 | — | — | CN | claimed |
| CN-119978252-A | High-strength high-toughness photo-curing material and preparation method and application thereof | 卡乐芙(上海)智能科技有限公司 | 2025-05-13 | — | — | CN | claimed |
| CN-119955422-A | High-adhesive-degree high-reliability ultraviolet light curing adhesive composition with high vehicle-gauge | 上海汉司实业有限公司 | 2025-05-09 | — | — | CN | claimed |
| WO-2025078829-A1 | PRINTING INK | FUJIFILM SPECIALITY INK SYSTEMS LIMITED (GB) | 2025-04-17 | — | — | WO | claimed |
| CN-119752364-A | Acrylic acid pressure-sensitive adhesive for promoting gas discharge and application thereof | 广东皇冠新材料科技有限公司 | 2025-04-04 | — | — | CN | claimed |
| WO-1995013331-A1 | PRESSURE SENSITIVE ADHESIVES | MINNESOTA MINING AND MANUFACTURING COMPANY (US) | 1995-05-18 | — | — | WO | claimed |
| EP-0406161-B1 | Fluorine and/or silicone containing poly(alkylene-oxide)-block copolymers and contact lenses thereof | CIBA GEIGY AG (CH) | 1995-02-22 | — | — | EP | claimed |
| EP-0590573-A2 | Resin for plastic lens | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1994-04-06 | — | — | EP | claimed |
| US-5115056-A | FLUORINE AND/OR SILICONE CONTAINING POLY(ALKYLENE-OXIDE)-BLOCK COPOLYMERS AND CONTACT LENSES THEREOF | CIBA-GEIGY CORPORATION (US) | 1992-05-19 | — | — | US | claimed |
| US-5039715-A | Photocurable acrylate adhesive containing perester/tautomeric acid adhesion promoter | DYMAX CORPORATION (US) | 1991-08-13 | — | — | US | claimed |
| EP-0406161-A2 | Fluorine and/or silicone containing poly(alkylene-oxide)-block copolymers and contact lenses thereof | CIBA-GEIGY AG (CH) | 1991-01-02 | — | — | EP | claimed |
| US-4964938-A | Bonding method using photocurable acrylate adhesive containing perester/tautomeric acid adhesion promoter | DYMAX CORPORATION (US) | 1990-10-23 | — | — | US | claimed |
| US-4963220-A | ALDEHYDE-AMINE ADDUCT AS PROMOTER FOR PERESTER CATALYST; POLYMERIZABLE ACRYLATE MONOMERS AND ACRYLATED RESINS | DYMAX CORPORATION (US) | 1990-10-16 | — | — | US | claimed |
| EP-0290147-A2 | Radiation-cured adhesive system containing perester/tautomeric acid adhesion promoter | DYMAX CORPORATION (US) | 1988-11-09 | — | — | EP | claimed |
| WO-1988005791-A1 | RADIATION-CURED ADHESIVE SYSTEM CONTAINING AMIDES | DYMAX CORPORATION (US) | 1988-08-11 | — | — | WO | claimed |