SCHEMBL685834

SCHEMBL685834

C=CC(=O)OC1(C)CCCC1

nearest known ligand 0.37

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
CYP19A1 P11511 1/20 0.37
TSHR P16473 6/20 0.33
HPGD P15428 1/20 0.32
ALDH1A1 P00352 4/20 0.31
TP53 P04637 2/20 0.31
HIF1A Q16665 2/20 0.31
CYP3A4 P08684 1/20 0.31
HSD17B10 Q99714 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL685818 0.98 CYP19A1 (0.39) CYP19A1TSHRHPGDALDH1A1TP53
SCHEMBL685581 0.98 CYP19A1 (0.39) CYP19A1TSHRHPGDALDH1A1TP53
SCHEMBL14557144 0.98 CYP19A1 (0.39) CYP19A1TSHRHPGDALDH1A1TP53
SCHEMBL75604 0.98 CYP19A1 (0.39) CYP19A1TSHRHPGDALDH1A1TP53
SCHEMBL6906500 0.98 CYP19A1 (0.39) CYP19A1TSHRHPGDALDH1A1TP53
Ethylene SCHEMBL27829154 0.96 CYP19A1 (0.38) CYP19A1TSHRHPGD
SCHEMBL673387 0.96 TSHR (0.33) CYP19A1TSHRHPGDALDH1A1TP53
Maleic Acid SCHEMBL28793659 0.89 HCAR2 (0.35) CYP19A1TSHRTP53
Methacrylic Acid SCHEMBL27616774 0.88 CYP19A1 (0.34) CYP19A1
Crotonic Acid SCHEMBL28793677 0.85 CYP19A1 (0.33) CYP19A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 465 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118853024-A High-nickel ternary positive electrode binder and preparation method and application thereof 深圳大学 2024-10-29 CN claimed
US-20260139155-A1 POLISHING AGENT AND METHOD FOR PRODUCING THE SAME, METHOD FOR PRODUCING POLISHING AGENT ADDITIVE LIQUID, POLISHING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR COMPONENT AGC Inc. (JP) 2026-05-21 US disclosed
US-20260049231-A1 POLISHING AGENT, POLISHING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR COMPONENT, AND ADDITIVE SOLUTION FOR POLISHING AGENT AGC Inc. (JP) 2026-02-19 US disclosed
EP-4112676-B1 METHOD FOR PRODUCING NITRILE RUBBER ZEON CORP (JP) 2026-02-18 EP disclosed
US-20260014805-A1 PHOTOCURABLE INK, INK CARTRIDGE, AND INKJET RECORDING METHOD CANON KK (JP) 2026-01-15 US disclosed
US-20250368860-A1 POLISHING AGENT, POLISHING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR COMPONENT, AND ADDITIVE SOLUTION FOR POLISHING AGENT AGC Inc. (JP) 2025-12-04 US disclosed
EP-3904430-B1 METHOD FOR RECYCLING NITRILE RUBBER ZEON CORP (JP) 2025-12-03 EP disclosed
US-12404350-B2 Method for producing nitrile rubber ZEON CORPORATION (JP) 2025-09-02 US disclosed
US-12351716-B2 Method for recycling nitrile rubber ZEON CORPORATION (JP) 2025-07-08 US disclosed
US-20250206924-A1 LATEX COMPOSITION AND DIP-MOLDED BODY ZEON CORPORATION (JP) 2025-06-26 US disclosed
US-20050214676-A1 Chemically amplified positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED 2005-09-29 US disclosed
EP-1557718-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2005-07-27 EP disclosed
EP-1546813-A1 LOW SILICON-OUTGASSING RESIST FOR BILAYER LITHOGRAPHY International Business Machines Corporation (US) 2005-06-29 EP disclosed
WO-2004068243-A1 LOW SILICON-OUTGASSING RESIST FOR BILAYER LITHOGRAPHY INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2004-08-12 WO disclosed
US-6770419-B2 Low silicon-outgassing resist for bilayer lithography INTERNATIONAL BUSINESS MACHINES CORPORATION 2004-08-03 US disclosed
US-20040048187-A1 Low silicon-outgassing resist for bilayer lithography GLOBALFOUNDRIES U.S. INC. 2004-03-11 US disclosed
US-6677419-B1 REACTING STOICHIOMETRIC EXCESS OF UNSATURATED ALICYCLIC MONOMER WITH ANOTHER UNSATURATED MONOMER, HAVING LESS THAN TWO ELECTRON-WITHDRAWING GROUPS APPENDED TO UNSATURATION, IN PRESENCE OF FREE RADICAL INITIATOR INTERNATIONAL BUSINESS MACHINES CORPORATION 2004-01-13 US disclosed
US-20020132185-A1 Copolymer photoresist with improved etch resistance INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2002-09-19 US disclosed
US-6010826-A Resist composition NIPPON ZEON CO., LTD. (JP) 2000-01-04 US disclosed
EP-0786701-A1 RESIST COMPOSITION NIPPON ZEON CO., LTD. (JP) 1997-07-30 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260049231-A1 POLISHING AGENT, POLISHING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR COMPONENT, AND ADDITIVE SOLUTION FOR POLISHING AGENT PRKAR2B, PRKAB1, PRKCZ CYP19A1 3738/4885TSHR 1285/4885HPGD 4195/4885
US-20260014805-A1 PHOTOCURABLE INK, INK CARTRIDGE, AND INKJET RECORDING METHOD ATM, ACR, MMAB CYP19A1 2002/4885TSHR 4390/4885HPGD 852/4885
US-20260139155-A1 POLISHING AGENT AND METHOD FOR PRODUCING THE SAME, METHOD FOR PRODUCING POLISHING AGENT ADDITIVE LIQUID, POLISHING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR COMPONENT NPM1, ATXN2, AP3S1 CYP19A1 4209/4885TSHR 4206/4885HPGD 4226/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.