SCHEMBL3354835

SCHEMBL3354835

CC(c1ccccc1)(c1ccc(O)c(OCCO)c1)c1ccc(O)c(OCCO)c1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 4/20 0.55
ESR2 Q92731 3/20 0.55
IDO1 P14902 1/20 0.46
CHEK1 O14757 1/20 0.42
ALDH1A1 P00352 2/20 0.40
RECQL P46063 1/20 0.40
LMNA P02545 2/20 0.39
JAK2 O60674 1/20 0.39
GAA P10253 1/20 0.39
MAPT P10636 1/20 0.39
CYP3A4 P08684 2/20 0.38
SMN1; SMN2 Q16637 2/20 0.38
CYP2D6 P10635 1/20 0.35
KDM4E B2RXH2 1/20 0.35
MEN1 O00255 1/20 0.35
POLB P06746 1/20 0.35
KMT2A Q03164 1/20 0.35
KLF10 Q13118 1/20 0.35
CNR1 P21554 1/20 0.35
CNR2 P34972 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5503968 0.84 ESR1 (0.53) ESR1ESR2IDO1ALDH1A1RECQL
SCHEMBL5502192 0.80 ESR1 (0.42) ESR1ESR2IDO1ALDH1A1RECQL
SCHEMBL9163204 0.80 ESR1 (0.64) ESR1ESR2GAAMAPTKDM4E
SCHEMBL19806912 0.78 SLC6A9 (0.49)
SCHEMBL5495360 0.78 PPARG (0.43) ESR1ESR2
SCHEMBL347297 0.78 ALDH1A1 (0.62) ESR1ESR2ALDH1A1RECQLLMNA
SCHEMBL29459482 0.75 ALDH1A1 (0.48) ESR1ESR2IDO1ALDH1A1RECQL
SCHEMBL15509371 0.75 ALDH1A1 (0.48) ESR1ESR2IDO1ALDH1A1RECQL
SCHEMBL23082274 0.75 PTGDR2 (0.47) ALDH1A1LMNASMN1; SMN2KDM4E
SCHEMBL3359572 0.75 ESR1 (0.57) ESR1ESR2ALDH1A1CYP3A4CYP2D6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1806618-B1 POSITIVE PHOTOSENSITIVE INSULATING RESIN COMPOSITION AND CURED PRODUCT THEREOF JSR CORP (JP) 2010-06-09 EP claimed
EP-1806618-B1 POSITIVE PHOTOSENSITIVE INSULATING RESIN COMPOSITION AND CURED PRODUCT THEREOF JSR CORP (JP) 2010-06-09 EP disclosed
US-20080097032-A1 Positive Photosensitive Insulating Resin Composition And Cured Product Thereof JSR CORPORATION (JP) 2008-04-24 US disclosed
EP-1806618-A1 POSITIVE PHOTOSENSITIVE INSULATING RESIN COMPOSITION AND CURED PRODUCT THEREOF JSR Corporation (JP) 2007-07-11 EP disclosed