⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5488952 | 0.75 | OPRM1 (0.31) | — | |
| SCHEMBL29187184 | 0.74 | — | — | |
| SCHEMBL28879224 | 0.69 | OPRM1 (0.31) | — | |
| SCHEMBL4442169 | 0.69 | — | — | |
| SCHEMBL1055776 | 0.68 | TET3 (0.30) | — | |
| SCHEMBL29243150 | 0.67 | MEN1 (0.33) | — | |
| SCHEMBL11700256 | 0.62 | OPRM1 (0.31) | — | |
| SCHEMBL28412642 | 0.62 | — | — | |
| SCHEMBL4440806 | 0.62 | — | — | |
| SCHEMBL1552116 | 0.62 | OPRM1 (0.36) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20060079099-A1 | Ultra low k plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2006-04-13 | — | — | US | claimed |
| US-20140050860-A1 | MATERIALS CONTAINING VOIDS WITH VOID SIZE CONTROLLED ON THE NANOMETER SCALE | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2014-02-20 | — | — | US | disclosed |
| US-8618183-B2 | Materials containing voids with void size controlled on the nanometer scale | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2013-12-31 | — | — | US | disclosed |
| US-20120328796-A1 | MATERIALS CONTAINING VOIDS WITH VOID SIZE CONTROLLED ON THE NANOMETER SCALE | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-12-27 | — | — | US | disclosed |
| US-8268411-B2 | Materials containing voids with void size controlled on the nanometer scale | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-09-18 | — | — | US | disclosed |
| US-8097932-B2 | Ultra low κ plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-01-17 | — | — | US | disclosed |
| US-7674521-B2 | Materials containing voids with void size controlled on the nanometer scale | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2010-03-09 | — | — | US | disclosed |
| US-20090297729-A1 | MATERIALS CONTAINING VOIDS WITH VOID SIZE CONTROLLED ON THE NANOMETER SCALE | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2009-12-03 | — | — | US | disclosed |
| US-20090146265-A1 | ULTRA LOW k PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION PROCESSES USING A SINGLE BIFUNCTIONAL PRECURSOR CONTAINING BOTH A SiCOH MATRIX FUNCTIONALITY AND ORGANIC POROGEN FUNCTIONALITY | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2009-06-11 | — | — | US | disclosed |
| US-7491658-B2 | Ultra low k plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2009-02-17 | — | — | US | disclosed |
| US-20070196639-A1 | Materials containing voids with void size controlled on the nanometer scale | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2007-08-23 | — | — | US | disclosed |
| CN-1941359-A | Porous composite material and method for making same | IBM (US) | 2007-04-04 | — | — | CN | disclosed |
| US-20060079099-A1 | Ultra low k plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2006-04-13 | — | — | US | disclosed |