SCHEMBL3360002

SCHEMBL3360002

CCO[SiH](CC(N)c1ccccc1)OCC

nearest known ligand 0.45

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
SCN4A P35499 11/20 0.43
TACR1 P25103 2/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2684234 0.81 SCN4A (0.46) SCN4ATACR1
SCHEMBL8767509 0.79 TAAR1 (0.45)
SCHEMBL9716565 0.78 LMNA (0.39)
SCHEMBL6743964 0.78 LMNA (0.35)
SCHEMBL63232 0.73 DPP4 (0.39) SCN4A
SCHEMBL56226 0.72 SCN4A (0.59) SCN4ATACR1
SCHEMBL1911339 0.72 SCN4A (0.59) SCN4ATACR1
SCHEMBL3685996 0.72 SCN4A (0.59) SCN4ATACR1
SCHEMBL20658090 0.72 HRH1 (0.42)
Hydrochloric Acid SCHEMBL4993677 0.71 SCN4A (0.57) SCN4ATACR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12261143-B2 Method of manufacturing substrate layered body and layered body MITSUI CHEMICALS, INC. (JP) 2025-03-25 US disclosed
WO-2025023139-A1 LAMINATE AND LAMINATE PRODUCTION METHOD 三井化学株式会社 2025-01-30 WO disclosed
WO-2025005084-A1 SUBSTRATE LAMINATE 三井化学株式会社 2025-01-02 WO disclosed
WO-2024225232-A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR PRODUCING SAME 三井化学株式会社 2024-10-31 WO disclosed
WO-2024177074-A1 METHOD FOR MANUFACTURING SUBSTRATE LAMINATE 三井化学株式会社 2024-08-29 WO disclosed
WO-2024177149-A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR PRODUCING SAME 三井化学株式会社 2024-08-29 WO disclosed
WO-2024177116-A1 PRODUCTION METHOD FOR SEMICONDUCTOR CHIP WITH RESIN LAYER AND PRODUCTION METHOD FOR SUBSTRATE LAMINATE 三井化学株式会社 2024-08-29 WO disclosed
WO-2024172044-A1 METHOD FOR MANUFACTURING SUBSTRATE LAYERED BODY, LAYERED BODY, AND SUBSTRATE LAYERED BODY 三井化学株式会社 2024-08-22 WO disclosed
WO-2024166789-A1 SEMICONDUCTOR STRUCTURE AND PRODUCTION METHOD FOR SAME 三井化学株式会社 2024-08-15 WO disclosed
WO-2024162446-A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME 三井化学株式会社 2024-08-08 WO disclosed
EP-2177562-B1 Polymer, rubber composition and tire using the same SUMITOMO RUBBER IND (JP) 2014-05-14 EP disclosed
EP-2184318-B1 Rubber composition and tire SUMITOMO RUBBER IND (JP) 2014-03-19 EP disclosed
US-8431644-B2 Rubber composition and tire SUMITOMO RUBBER INDUSTRIES, LTD. (JP) 2013-04-30 US disclosed
EP-2182028-B1 Rubber composition and tire SUMITOMO RUBBER IND (JP) 2012-12-12 EP disclosed
EP-2184318-A2 Rubber composition and tire Sumitomo Rubber Industries, Ltd. (JP) 2010-05-12 EP disclosed
EP-2182028-A1 Rubber composition and tire Sumitomo Rubber Industries, Ltd. (JP) 2010-05-05 EP disclosed
US-20100105826-A1 RUBBER COMPOSITION AND TIRE SUMITOMO RUBBER INDUSTRIES, LTD. (JP) 2010-04-29 US disclosed
US-20100099795-A1 RUBBER COMPOSITION AND TIRE SUMITOMO RUBBER INDUSTRIES, LTD. (JP) 2010-04-22 US disclosed
US-20100099810-A1 POLYMER, RUBBER COMPOSITION AND TIRE USING THE SAME SUMITOMO RUBBER INDUSTRIES, LTD. (JP) 2010-04-22 US disclosed
EP-2177562-A2 Polymer, rubber composition and tire using the same Sumitomo Rubber Industries, Ltd. (JP) 2010-04-21 EP disclosed