SCHEMBL3362486

SCHEMBL3362486

COC(CC1CC2C=CC1C2)(C(F)(F)F)C(F)(F)F

nearest known ligand 0.38

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 8/20 0.38
ALDH1A1 P00352 3/20 0.38
MEN1 O00255 3/20 0.33
KMT2A Q03164 3/20 0.33
CYP1A2 P05177 1/20 0.33
CYP3A4 P08684 1/20 0.33
CYP2D6 P10635 1/20 0.33
CYP2C19 P33261 1/20 0.33
ATM Q13315 1/20 0.33
HTT P42858 1/20 0.32
TSHR P16473 1/20 0.31
POLB P06746 1/20 0.31
ALOX15 P16050 1/20 0.31
TDP1 Q9NUW8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10300866 0.84 KDM4E (0.35) KDM4EALDH1A1MEN1KMT2ACYP1A2
SCHEMBL15492228 0.83 KDM4E (0.35) KDM4EALDH1A1MEN1KMT2ACYP1A2
SCHEMBL3364668 0.82 KDM4E (0.37) KDM4EALDH1A1MEN1KMT2ACYP1A2
SCHEMBL3363142 0.80 KDM4E (0.35) KDM4EALDH1A1MEN1KMT2ACYP1A2
SCHEMBL4952386 0.79 KDM4E (0.36) KDM4EALDH1A1MEN1KMT2ACYP1A2
SCHEMBL6423573 0.78 KDM4E (0.38) KDM4EALDH1A1MEN1KMT2ACYP1A2
SCHEMBL24355008 0.78 KDM4E (0.34) KDM4EALDH1A1POLBALOX15TDP1
SCHEMBL6330510 0.78 KDM4E (0.35) KDM4EALDH1A1
SCHEMBL13743053 0.78 KDM4E (0.35) KDM4EALDH1A1MEN1KMT2ACYP1A2
SCHEMBL12577685 0.77 KDM4E (0.41) KDM4EALDH1A1MEN1KMT2ACYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8678203-B2 Polynorbornene pervaporation membrane films, preparation and use thereof PROMERUS, LLC (US) 2014-03-25 US disclosed
US-20130292872-A1 Polynorbornene Pervaporation Membrane Films, Preparation and Use Thereof PROMERUS, LLC 2013-11-07 US disclosed
US-8470944-B2 Polynorbornene pervaporation membrane films, preparation and use thereof PROMERUS, LLC (US) 2013-06-25 US disclosed
EP-1164434-B1 Radiation-sensitive resin composition JSR CORP (JP) 2010-10-06 EP disclosed
US-7714079-B2 Ultra-large scale integrated (ULSI); film stack; hydrosilation INTERNATIONAL BUSINESS MACHINES CORPORAITON (US) 2010-05-11 US disclosed
US-20080063880-A1 Ultra-large scale integrated (ULSI); film stack; hydrosilation INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2008-03-13 US disclosed
US-7306853-B2 Ultra-large scale integrated interconnect structures; forming via and/or line patterns in a curable caged polysilsesquioxane, curing and filling the patterns with a conductor; combines the functions of a photoresist and a conventional low-k dielectric into a single material INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2007-12-11 US disclosed
US-7202016-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2007-04-10 US disclosed
US-6964840-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2005-11-15 US disclosed
US-20050214680-A1 Radiation-sensitive resin composition MIYAJI MASAAKI 2005-09-29 US disclosed
US-6933094-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2005-08-23 US disclosed
US-20040241580-A1 Radiation-sensitive resin composition NISHIMURA YUKIO (JP) 2004-12-02 US disclosed
US-6800414-B2 FLUOROPOLYMER JSR CORPORATION (JP) 2004-10-05 US disclosed
US-6623907-B2 Chemical amplified photoresist JSR CORPORATION (JP) 2003-09-23 US disclosed
US-20020058201-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-05-16 US disclosed
EP-1193558-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2002-04-03 EP disclosed
US-20020009668-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-01-24 US disclosed
EP-1164434-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2001-12-19 EP disclosed
US-20010023050-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2001-09-20 US disclosed
EP-1122605-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2001-08-08 EP disclosed