Tetrabuthylammonium

Tetrabuthylammonium

SCHEMBL3363674

CCCC[N+](CCCC)(CCCC)CCCC.[BH3-]CCCCCC(c1ccccc1F)(c1ccccc1F)c1ccccc1F

nearest known ligand 0.34

Full drug profile on Sugi Atlas →

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 5/20 0.33
SLC22A1 O15245 2/20 0.32
KCNH2 Q12809 1/20 0.31
TP53 P04637 2/20 0.31
SMN1; SMN2 Q16637 2/20 0.31
ALDH1A1 P00352 1/20 0.31
CYP3A4 P08684 1/20 0.31
ALOX15 P16050 1/20 0.31
TSHR P16473 1/20 0.31
ALOX12 P18054 1/20 0.31
HIF1A Q16665 1/20 0.31
HSD17B10 Q99714 1/20 0.31
MEN1 O00255 1/20 0.31
MAPK1 P28482 1/20 0.31
KMT2A Q03164 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Tetrylammonium SCHEMBL3362447 0.89 KIF11 (0.32)
Tetramethylammonium Ion SCHEMBL3360774 0.86 KIF11 (0.33)
Tetrylammonium SCHEMBL3360743 0.83 KIF11 (0.33)
Tetrabuthylammonium SCHEMBL11969818 0.82 CHAT (0.33) SMN1; SMN2ALDH1A1MEN1MAPK1KMT2A
Tetrabuthylammonium SCHEMBL810025 0.80 KIF11 (0.42) DNM1SLC22A1KCNH2TP53SMN1; SMN2
Tetramethylammonium Ion SCHEMBL3364698 0.79 KIF11 (0.35)
Tetrabuthylammonium SCHEMBL14672898 0.79 SLC22A1 (0.35) DNM1SLC22A1KCNH2ALDH1A1TSHR
Tetrabuthylammonium SCHEMBL809814 0.76 SCN5A (0.36) SLC22A1KCNH2CYP3A4
Tetrabuthylammonium SCHEMBL11969372 0.76 TLR8 (0.33) SLC22A1SMN1; SMN2ALDH1A1MEN1MAPK1
Tetrabuthylammonium SCHEMBL1350363 0.74 KIF11 (0.44) DNM1SLC22A1KCNH2TP53SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2172806-A2 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board Hitachi Chemical Company, Ltd. (JP) 2010-04-07 EP disclosed
US-7232647-B2 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board HITACHI CHEMICAL CO., LTD. (JP) 2007-06-19 US disclosed
US-7220533-B2 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, and method for producing printed wiring board HITACHI CHEMICAL CO., LTD. (JP) 2007-05-22 US disclosed
US-20050164124-A1 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board HITACHI CHEMICAL CO., LTD. (JP) 2005-07-28 US disclosed
US-20040038149-A1 Photosensitive resin composition, photosensitive element comprising the same, method for producing resist pattern, and method for producing printed wiring board HITACHI CHEMICAL CO., LTD. (JP) 2004-02-26 US disclosed
EP-1282010-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT COMPRISING THE SAME, METHOD FOR PRODUCING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD HITACHI CHEMICAL COMPANY, LTD. (JP) 2003-02-05 EP disclosed