Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 7/20 | 0.44 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.40 |
| ▸ | GAA | P10253 | 1/20 | 0.39 |
| ▸ | MAPT | P10636 | 7/20 | 0.38 |
| ▸ | MAPK1 | P28482 | 3/20 | 0.35 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.35 |
| ▸ | HTT | P42858 | 5/20 | 0.35 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.35 |
| ▸ | LMNA | P02545 | 2/20 | 0.35 |
| ▸ | POLB | P06746 | 2/20 | 0.34 |
| ▸ | HPGD | P15428 | 2/20 | 0.34 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.34 |
| ▸ | SLC1A3 | P43003 | 1/20 | 0.34 |
| ▸ | SLC1A2 | P43004 | 1/20 | 0.34 |
| ▸ | SLC1A1 | P43005 | 1/20 | 0.34 |
| ▸ | TP53 | P04637 | 1/20 | 0.34 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.34 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.33 |
| ▸ | TSHR | P16473 | 1/20 | 0.33 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12079742 | 0.81 | ALDH1A1 (0.40) | ALDH1A1CYP2D6GAAMAPTMAPK1 | |
| SCHEMBL1152092 | 0.80 | — | — | |
| Water SCHEMBL11881132 | 0.78 | ALDH1A1 (0.52) | ALDH1A1CYP2D6GAAMAPTMAPK1 | |
| SCHEMBL15842422 | 0.76 | ALDH1A1 (0.39) | ALDH1A1GAAMAPTMAPK1TDP1 | |
| SCHEMBL891457 | 0.75 | ALDH1A1 (0.55) | ALDH1A1CYP2D6GAAMAPTMAPK1 | |
| SCHEMBL20324523 | 0.75 | ALDH1A1 (0.49) | ALDH1A1CYP2D6GAAMAPTMAPK1 | |
| SCHEMBL28521894 | 0.74 | ALDH1A1 (0.55) | ALDH1A1CYP2D6GAAMAPTMAPK1 | |
| SCHEMBL20324517 | 0.74 | ALDH1A1 (0.47) | ALDH1A1CYP2D6GAAMAPTMAPK1 | |
| Water SCHEMBL4188957 | 0.74 | ALDH1A1 (0.47) | ALDH1A1CYP2D6GAAMAPTMAPK1 | |
| SCHEMBL20324519 | 0.74 | ALDH1A1 (0.47) | ALDH1A1CYP2D6GAAMAPTMAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 121 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12109812-B2 | Ink jet printing method and ink jet printing apparatus | SEIKO EPSON CORPORATION (JP) | 2024-10-08 | — | — | US | disclosed |
| US-20220032618-A1 | Ink Jet Printing Method And Ink Jet Printing Apparatus | SEIKO EPSON CORPORATION (JP) | 2022-02-03 | — | — | US | disclosed |
| US-11021572-B2 | Photosensitive resin composition, cured product of same, interlayer insulating film, surface protective film and electronic component | HD MICROSYSTEMS, LTD. (JP) | 2021-06-01 | — | — | US | disclosed |
| EP-3067395-B1 | ULTRAVIOLET RADIATION-CURABLE COMPOSITION, AND RECORDED MATTER | SEIKO EPSON CORP (JP) | 2020-10-28 | — | — | EP | disclosed |
| US-10759119-B2 | Three dimensional mold object manufacturing apparatus, method for manufacturing three dimensional mold object, and three dimensional mold object | SEIKO EPSON CORPORATION (JP) | 2020-09-01 | — | — | US | disclosed |
| US-10392522-B2 | Ultraviolet curable composition and recorded object | SEIKO EPSON CORPORATION (JP) | 2019-08-27 | — | — | US | disclosed |
| US-20190161580-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT OF SAME, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM AND ELECTRONIC COMPONENT | HD MICROSYSTEMS, LTD. (JP) | 2019-05-30 | — | — | US | disclosed |
| US-10300708-B2 | Ink jet composition, housing, and ink jet method | SEIKO EPSON CORPORATION (JP) | 2019-05-28 | — | — | US | disclosed |
| US-10279603-B2 | Production method of recording material, and recording material | SEIKO EPSON CORPORATION (JP) | 2019-05-07 | — | — | US | disclosed |
| US-10259208-B2 | Three-dimensional shaped object manufacturing device, method for manufacturing three-dimensional shaped object, and three-dimensional shaped object | SEIKO EPSON CORPORATION (JP) | 2019-04-16 | — | — | US | disclosed |
| US-7500895-B2 | Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device | SEIKO EPSON CORPORATION (JP) | 2009-03-10 | — | — | US | disclosed |
| US-20090050020-A1 | COMPOSITION FOR RESIST UNDERLAYER FILM AND PROCESS FOR PRODUCING SAME | JSR CORPORATION (JP) | 2009-02-26 | — | — | US | disclosed |
| US-20080317943-A1 | METHOD FOR FORMING PATTERN, METHOD FOR MANUFACTURING ELECTRO-OPTICAL DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | SEIKO EPSON CORPORATION (JP) | 2008-12-25 | — | — | US | disclosed |
| US-20080311285-A1 | CONTACT HOLE FORMING METHOD, CONDUCTING POST FORMING METHOD, WIRING PATTERN FORMING METHOD, MULTILAYERED WIRING SUBSTRATE PRODUCING METHOD, ELECTRO-OPTICAL DEVICE PRODUCING METHOD, AND ELECTRONIC APPARATUS PRODUCING METHOD | SEIKO EPSON CORPORATION (JP) | 2008-12-18 | — | — | US | disclosed |
| EP-1855159-A1 | COMPOSITION FOR UNDERLAYER FILM OF RESIST AND PROCESS FOR PRODUCING THE SAME | JSR Corporation (JP) | 2007-11-14 | — | — | EP | disclosed |
| US-20060127563-A1 | Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device | SEIKO EPSON CORPORATION (JP) | 2006-06-15 | — | — | US | disclosed |
| US-20060019034-A1 | Process for producing chemical adsorption film and chemical adsorption film | SEIKO EPSON CORPORATION (JP) | 2006-01-26 | — | — | US | disclosed |
| US-20050287392-A1 | Organic electroluminescent device, method for producing the same, and electronic apparatus | SEIKO EPSON CORPORATION (JP) | 2005-12-29 | — | — | US | disclosed |
| US-6960420-B2 | Photosensitive resin composition, process for forming relief pattern, and electronic component | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) | 2005-11-01 | — | — | US | disclosed |
| US-20040142275-A1 | Photosensitive resin composition, process for forming relief pattern, and electronic component | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2004-07-22 | — | — | US | disclosed |