Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LRRK2 | Q5S007 | 2/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5654718 | 0.89 | — | — | |
| SCHEMBL12949311 | 0.87 | PDE4A (0.31) | — | |
| SCHEMBL12949425 | 0.87 | PDE4A (0.31) | — | |
| SCHEMBL12949467 | 0.87 | PDE4A (0.31) | — | |
| SCHEMBL18577963 | 0.85 | — | — | |
| SCHEMBL11451410 | 0.85 | ALDH1A1 (0.30) | — | |
| SCHEMBL18555995 | 0.85 | — | — | |
| SCHEMBL2013966 | 0.85 | — | — | |
| SCHEMBL24246548 | 0.83 | GPR119 (0.31) | — | |
| SCHEMBL938623 | 0.83 | GPR119 (0.31) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0464058-B1 | FERROELECTRIC LIQUID CRYSTAL MIXTURES | HOECHST AG (DE) | 1995-06-14 | — | — | EP | claimed |
| US-5378394-A | Pyrimidine compounds | HOECHST AKTIENGESELLSCHAFT (DE) | 1995-01-03 | — | — | US | claimed |
| US-8361697-B2 | Photosensitive resin composition, photosensitive resin laminate, method for forming resist pattern and process for producing printed circuit board, lead frame, semiconductor package and concavoconvex board | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2013-01-29 | — | — | US | disclosed |
| US-20100297559-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, METHOD FOR FORMING RESIST PATTERN AND PROCESS FOR PRODUCING PRINTED CIRCUIT BOARD, LEAD FRAME, SEMICONDUCTOR PACKAGE AND CONCAVOCONVEX BOARD | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2010-11-25 | — | — | US | disclosed |
| US-20100159691-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE | ASAHI KASEI EMD CORPORATION (JP) | 2010-06-24 | — | — | US | disclosed |
| EP-0774687-B1 | Solid processing composition and method for processing silver halide photographic light-sensitive material | KONISHIROKU PHOTO IND (JP) | 2004-09-15 | — | — | EP | disclosed |
| US-5851742-A | Solid processing composition and method for processing silver halide photographic light-sensitive material | KONICA CORPORATION (JP) | 1998-12-22 | — | — | US | disclosed |
| EP-0774687-A1 | Solid processing composition and method for processing silver halide photographic light-sensitive material | KONICA CORPORATION (JP) | 1997-05-21 | — | — | EP | disclosed |
| US-5378394-A | Pyrimidine compounds | HOECHST AKTIENGESELLSCHAFT (DE) | 1995-01-03 | — | — | US | disclosed |