⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3382918 | 0.87 | — | — | |
| SCHEMBL3384792 | 0.83 | TSHR (0.30) | — | |
| SCHEMBL10435421 | 0.80 | — | — | |
| SCHEMBL10715949 | 0.78 | — | — | |
| SCHEMBL18245138 | 0.78 | TSHR (0.31) | — | |
| SCHEMBL3382409 | 0.77 | — | — | |
| SCHEMBL3383738 | 0.76 | — | — | |
| SCHEMBL3384470 | 0.74 | — | — | |
| SCHEMBL8525502 | 0.73 | — | — | |
| SCHEMBL10456406 | 0.73 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0991082-B1 | COMPOSITE DIELECTRIC MATERIAL COMPOSITION, AND FILM, SUBSTRATE, ELECTRONIC PARTS AND MOLDINGS THEREFROM | TDK CORP (JP) | 2010-11-24 | — | — | EP | disclosed |
| EP-0953608-B1 | HEAT-RESISTANT, LOWLY DIELECTRIC HIGH-MOLECULAR MATERIAL, AND FILMS, SUBSTRATES, ELECTRIC COMPONENTS AND HEAT-RESISTANT RESIN MOLDINGS PRODUCED THEREFROM | TDK CORP (JP) | 2008-12-24 | — | — | EP | disclosed |
| US-6500535-B1 | FINELY DISPERSED CROSSLINKED TERPOLYMER COMPRISING ALPHA-OLEFIN, CONJUGATED DIENE, AND VINYL AROMATIC MONOMERS | TDK CORPORATION (JP) | 2002-12-31 | — | — | US | disclosed |
| US-20020190818-A1 | High frequency band pass filter | TDK CORPORATION (JP) | 2002-12-19 | — | — | US | disclosed |
| US-6420476-B1 | MOLECULAR WEIGHT CONTROL FOR HEAT RESISTANT LOW DIELECTRIC POLYMER | TDK CORPORATION (JP) | 2002-07-16 | — | — | US | disclosed |
| EP-0991082-A1 | COMPOSITE DIELECTRIC MATERIAL COMPOSITION, AND FILM, SUBSTRATE, ELECTRONIC PARTS AND MOLDINGS THEREFROM | TDK Corporation (JP) | 2000-04-05 | — | — | EP | disclosed |
| EP-0953608-A1 | HEAT-RESISTANT, LOWLY DIELECTRIC HIGH-MOLECULAR MATERIAL, AND FILMS, SUBSTRATES, ELECTRIC COMPONENTS AND HEAT-RESISTANT RESIN MOLDINGS PRODUCED THEREFROM | TDK Corporation (JP) | 1999-11-03 | — | — | EP | disclosed |
| EP-0295821-B1 | Method for production of graft resin composition | NIPPON OILS & FATS CO LTD (JP) | 1994-01-05 | — | — | EP | disclosed |
| EP-0422229-A1 | ADHESIVE RESIN COMPOSITION, PREPARATION THEREOF, AND LAMINATE COMPRISING SAME | NIPPON PETROCHEMICALS COMPANY, LIMITED (JP) | 1991-04-17 | — | — | EP | disclosed |
| EP-0368295-A2 | Thermoplastic resin composition and method for preparing the same | NIPPON PETROCHEMICALS CO., LTD. (JP) | 1990-05-16 | — | — | EP | disclosed |
| EP-0361400-A2 | Thermoplastic resin composition | NIPPON PETROCHEMICALS COMPANY, LIMITED (JP) | 1990-04-04 | — | — | EP | disclosed |
| US-4839423-A | USING A UNSATURATED ORGANIC PEROXY FREE RADICAL CATALYSY | NIPPON OIL & FATS CO., LTD. (JP) | 1989-06-13 | — | — | US | disclosed |
| EP-0314188-A2 | Thermoplastic resin composition and method for preparing the same | NIPPON PETROCHEMICALS CO., LTD. (JP) | 1989-05-03 | — | — | EP | disclosed |