SCHEMBL3384470

SCHEMBL3384470

C=C(OOC(C)(C)CC(C)(C)C)C(=O)OC(C)OC(C)OC(=O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3382409 0.94
SCHEMBL7683847 0.87
SCHEMBL28487610 0.86
SCHEMBL7690559 0.84 ALDH1A1 (0.31)
SCHEMBL7691177 0.81
SCHEMBL2774388 0.81
SCHEMBL8525502 0.80
SCHEMBL10482046 0.80
SCHEMBL464855 0.77 ALDH1A1 (0.33)
SCHEMBL3383005 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 61 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3284784-A1 METHACRYLIC RESIN COMPOSITION Kuraray Co., Ltd. (JP) 2018-02-21 EP disclosed
EP-0991082-B1 COMPOSITE DIELECTRIC MATERIAL COMPOSITION, AND FILM, SUBSTRATE, ELECTRONIC PARTS AND MOLDINGS THEREFROM TDK CORP (JP) 2010-11-24 EP disclosed
EP-0953608-B1 HEAT-RESISTANT, LOWLY DIELECTRIC HIGH-MOLECULAR MATERIAL, AND FILMS, SUBSTRATES, ELECTRIC COMPONENTS AND HEAT-RESISTANT RESIN MOLDINGS PRODUCED THEREFROM TDK CORP (JP) 2008-12-24 EP disclosed
US-6500535-B1 FINELY DISPERSED CROSSLINKED TERPOLYMER COMPRISING ALPHA-OLEFIN, CONJUGATED DIENE, AND VINYL AROMATIC MONOMERS TDK CORPORATION (JP) 2002-12-31 US disclosed
US-20020190818-A1 High frequency band pass filter TDK CORPORATION (JP) 2002-12-19 US disclosed
US-6420476-B1 MOLECULAR WEIGHT CONTROL FOR HEAT RESISTANT LOW DIELECTRIC POLYMER TDK CORPORATION (JP) 2002-07-16 US disclosed
US-6335401-B1 ADHESION PRIMER ATOFINA (FR) 2002-01-01 US disclosed
EP-0991082-A1 COMPOSITE DIELECTRIC MATERIAL COMPOSITION, AND FILM, SUBSTRATE, ELECTRONIC PARTS AND MOLDINGS THEREFROM TDK Corporation (JP) 2000-04-05 EP disclosed
EP-0953608-A1 HEAT-RESISTANT, LOWLY DIELECTRIC HIGH-MOLECULAR MATERIAL, AND FILMS, SUBSTRATES, ELECTRIC COMPONENTS AND HEAT-RESISTANT RESIN MOLDINGS PRODUCED THEREFROM TDK Corporation (JP) 1999-11-03 EP disclosed
US-5674930-A MOLDING MATERIAL COMPRISING A BLEND OF A PROPYLENE BASED POLYMER AND A GRAFT ADDITION COPOLYMER; IMPACT STRENGTH, COATABILITY; BUMPER OF AUTOMOBILE NOF CORPORATION (JP) 1997-10-07 US disclosed
EP-0361400-A2 Thermoplastic resin composition NIPPON PETROCHEMICALS COMPANY, LIMITED (JP) 1990-04-04 EP disclosed
US-4879347-A ETHYLENE POLYMER, VINYL MONOMER, RADICAL POLYMERIZABLE ORGANIC PEROXIDE, FREE RADICAL CATALYST, COPOLYMERIZATION NIPPON OIL AND FATS CO., LTD. (JP) 1989-11-07 US disclosed
US-4877841-A GRAFT POLYMER OF POLYETHYLENE, UNSATURATED MONOMER AND AN UNSATURATED PEROXYCARBONATE; SOLUBILIZERS FOR POLYMER BLENDS NIPPON OIL AND FATS CO., LTD. (JP) 1989-10-31 US disclosed
US-4839423-A USING A UNSATURATED ORGANIC PEROXY FREE RADICAL CATALYSY NIPPON OIL & FATS CO., LTD. (JP) 1989-06-13 US disclosed
US-4839432-A USING A UNSATURATED PEROXY FREE RADICAL CATALYSTS NIPPON OIL AND FATS CO., LTD. (JP) 1989-06-13 US disclosed
EP-0314188-A2 Thermoplastic resin composition and method for preparing the same NIPPON PETROCHEMICALS CO., LTD. (JP) 1989-05-03 EP disclosed
EP-0304041-A2 Thermoplastic resin composition. NIPPON PETROCHEMICALS COMPANY, LIMITED (JP) 1989-02-22 EP disclosed
EP-0289933-A2 Graft polymerization precurser and method manufacturing the same NIPPON OIL AND FATS COMPANY, LIMITED (JP) 1988-11-09 EP disclosed
EP-0279430-A2 The method of manufacturing a grafted resin composition NIPPON OIL AND FATS COMPANY, LIMITED (JP) 1988-08-24 EP disclosed
EP-0277608-A2 Graft polymerization preformer and method of manufacturing the same NIPPON OIL AND FATS COMPANY, LIMITED (JP) 1988-08-10 EP disclosed