SCHEMBL3382409

SCHEMBL3382409

C=C(OOC(C)(C)CC(C)(C)C)C(=O)OC(C)OC(=O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3384470 0.94
SCHEMBL2774388 0.87
SCHEMBL464855 0.83 ALDH1A1 (0.33)
SCHEMBL8525502 0.82
SCHEMBL7683847 0.81
SCHEMBL2768953 0.80
SCHEMBL28487610 0.80
SCHEMBL7690559 0.77 ALDH1A1 (0.31)
SCHEMBL3382079 0.77
SCHEMBL7685060 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3284784-A1 METHACRYLIC RESIN COMPOSITION Kuraray Co., Ltd. (JP) 2018-02-21 EP disclosed
EP-0991082-B1 COMPOSITE DIELECTRIC MATERIAL COMPOSITION, AND FILM, SUBSTRATE, ELECTRONIC PARTS AND MOLDINGS THEREFROM TDK CORP (JP) 2010-11-24 EP disclosed
EP-0953608-B1 HEAT-RESISTANT, LOWLY DIELECTRIC HIGH-MOLECULAR MATERIAL, AND FILMS, SUBSTRATES, ELECTRIC COMPONENTS AND HEAT-RESISTANT RESIN MOLDINGS PRODUCED THEREFROM TDK CORP (JP) 2008-12-24 EP disclosed
US-6500535-B1 FINELY DISPERSED CROSSLINKED TERPOLYMER COMPRISING ALPHA-OLEFIN, CONJUGATED DIENE, AND VINYL AROMATIC MONOMERS TDK CORPORATION (JP) 2002-12-31 US disclosed
US-20020190818-A1 High frequency band pass filter TDK CORPORATION (JP) 2002-12-19 US disclosed
US-6420476-B1 MOLECULAR WEIGHT CONTROL FOR HEAT RESISTANT LOW DIELECTRIC POLYMER TDK CORPORATION (JP) 2002-07-16 US disclosed
US-6335401-B1 ADHESION PRIMER ATOFINA (FR) 2002-01-01 US disclosed
EP-0991082-A1 COMPOSITE DIELECTRIC MATERIAL COMPOSITION, AND FILM, SUBSTRATE, ELECTRONIC PARTS AND MOLDINGS THEREFROM TDK Corporation (JP) 2000-04-05 EP disclosed
EP-0953608-A1 HEAT-RESISTANT, LOWLY DIELECTRIC HIGH-MOLECULAR MATERIAL, AND FILMS, SUBSTRATES, ELECTRIC COMPONENTS AND HEAT-RESISTANT RESIN MOLDINGS PRODUCED THEREFROM TDK Corporation (JP) 1999-11-03 EP disclosed
US-5674930-A MOLDING MATERIAL COMPRISING A BLEND OF A PROPYLENE BASED POLYMER AND A GRAFT ADDITION COPOLYMER; IMPACT STRENGTH, COATABILITY; BUMPER OF AUTOMOBILE NOF CORPORATION (JP) 1997-10-07 US disclosed
EP-0488119-A2 Mouldable thermoplastic resin composition NIPPON PETROCHEMICALS COMPANY, LIMITED (JP) 1992-06-03 EP disclosed
US-5036120-A Polyoxymethylene and/or polycarbonate, ethylene-glycidyl acrylate or methacrylate polymer, addition polymer with peroxy groups, graft polymerization NIPPON PETROCHEMICALS CO., LTD. (JP) 1991-07-30 US disclosed
EP-0435247-A1 Thermoplastic resin compositions and their use NIPPON PETROCHEMICALS COMPANY, LIMITED (JP) 1991-07-03 EP disclosed
EP-0435340-A1 Thermoplastic resin compositions NIPPON PETROCHEMICALS COMPANY, LIMITED (JP) 1991-07-03 EP disclosed
EP-0412572-A2 Thermoplastic resin composition and method for preparing the same NIPPON PETROCHEMICALS CO., LTD. (JP) 1991-02-13 EP disclosed
US-4987165-A MULTIPHASE COMPATIBILIZER FOR BLEND OF POLYSULFONE AND ACRYLONITRILE-BUTADIENE-STYRENE TERPOLYMER NIPPON PETROCHEMICALS CO., LTD. (JP) 1991-01-22 US disclosed
US-4983663-A Polymer alloy of an ABS terpolymer, an aromatic polyester or polyamide and an epoxy-containing graft addition polymer also containing an unsaturated peroxide; impact strength; molding materials NIPPON PETROCHEMICALS CO. (JP) 1991-01-08 US disclosed
US-4962148-A HIGH STRENGTH, CHEMICAL RESISTANCE, MOLDING MATERIALS NIPPON PETROCHEMICALS CO., LTD (JP) 1990-10-09 US disclosed
US-4839423-A USING A UNSATURATED ORGANIC PEROXY FREE RADICAL CATALYSY NIPPON OIL & FATS CO., LTD. (JP) 1989-06-13 US disclosed
EP-0295821-A2 Method for production of graft resin composition NIPPON OIL AND FATS COMPANY, LIMITED (JP) 1988-12-21 EP disclosed