⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27826327 | 0.90 | PTGS2 (0.39) | — | |
| SCHEMBL15511257 | 0.84 | — | — | |
| SCHEMBL9209601 | 0.84 | — | — | |
| SCHEMBL15511258 | 0.84 | — | — | |
| SCHEMBL15511407 | 0.84 | — | — | |
| SCHEMBL14307619 | 0.83 | — | — | |
| SCHEMBL316396 | 0.83 | — | — | |
| SCHEMBL28107587 | 0.83 | — | — | |
| SCHEMBL196177 | 0.81 | ALDH1A1 (0.49) | — | |
| SCHEMBL11241473 | 0.80 | ALDH1A1 (0.47) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 310 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9611143-B2 | Method for forming chip package | XINTEC INC. (TW) | 2017-04-04 | — | — | US | claimed |
| US-8633582-B2 | Chip package and fabrication method thereof | XINTEC INC. (TW) | 2014-01-21 | — | — | US | claimed |
| US-8541877-B2 | Electronic device package and method for fabricating the same | XINTEC INC. (TW) | 2013-09-24 | — | — | US | claimed |
| US-20110140267-A1 | ELECTRONIC DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME | XINTEC INC. (TW) | 2011-06-16 | — | — | US | claimed |
| US-20110042796-A1 | CHIP PACKAGE AND FABRICATION METHOD THEREOF | XINTEC INC. (TW) | 2011-02-24 | — | — | US | claimed |
| US-7129173-B2 | Process for producing and removing a mask layer | INFINEON TECHNOLOGIES AG (DE) | 2006-10-31 | — | — | US | claimed |
| US-20040048479-A1 | Process for producing and removing a mask layer | POLARIS INNOVATIONS LIMITED (IE) | 2004-03-11 | — | — | US | claimed |
| US-20250359385-A1 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME | XINTEC INC (TW) | 2025-11-20 | — | — | US | disclosed |
| US-12477848-B2 | Chip package and method for forming the same | XINTEC INC. (TW) | 2025-11-18 | — | — | US | disclosed |
| US-12463102-B2 | Semiconductor device structure and method for forming the same | XINTEC INC. (TW) | 2025-11-04 | — | — | US | disclosed |
| CN-111834295-B | Optical chip package and method for manufacturing the same | 精材科技股份有限公司 | 2025-06-03 | — | — | CN | disclosed |
| CN-120072804-A | Chip package | 精材科技股份有限公司 | 2025-05-30 | — | — | CN | disclosed |
| US-20250174574-A1 | CHIP PACKAGE WITH ELECTRICAL SHIELDING STRUCTURE AND MESH PAD STRUCTURE | XINTEC INC. (TW) | 2025-05-29 | — | — | US | disclosed |
| WO-2003025986-A1 | BONDING METHOD | MICRONIC LASER SYSTEMS AB (SE) | 2003-03-27 | — | — | WO | disclosed |
| EP-1275146-A1 | METHOD OF JOINING COMPONENTS | Kälvesten, Edouard (SE) | 2003-01-15 | — | — | EP | disclosed |
| EP-1233669-A2 | BLOCKING AN ETHYLENE RESPONSE IN PLANTS USING CYCLOPROPENE DERIVATIVES | NORTH CAROLINA STATE UNIVERSITY (US) | 2002-08-28 | — | — | EP | disclosed |
| US-6365549-B2 | PRESERVATION | NORTH CAROLINA STATE UNIVERSITY | 2002-04-02 | — | — | US | disclosed |
| US-20010019995-A1 | Methods of blocking an ethylene response in plants using cyclopropene derivatives | NORTH CAROLINA STATE UNIVERSITY | 2001-09-06 | — | — | US | disclosed |
| WO-2001054189-A1 | METHOD OF JOINING COMPONENTS | KAELVESTEN EDOUARD (SE) | 2001-07-26 | — | — | WO | disclosed |
| WO-2001037663-A2 | BLOCKING AN ETHYLENE RESPONSE IN PLANTS USING CYCLOPROPENE DERIVATIVES | NORTH CAROLINA STATE UNIVERSITY (US) | 2001-05-31 | — | — | WO | disclosed |