Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HPGD | P15428 | 3/20 | 0.61 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.61 |
| ▸ | MAPT | P10636 | 2/20 | 0.61 |
| ▸ | THRB | P10828 | 2/20 | 0.61 |
| ▸ | TSHR | P16473 | 2/20 | 0.61 |
| ▸ | APP | P05067 | 1/20 | 0.61 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.61 |
| ▸ | CASP1 | P29466 | 1/20 | 0.61 |
| ▸ | SNCA | P37840 | 1/20 | 0.61 |
| ▸ | RECQL | P46063 | 1/20 | 0.61 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.61 |
| ▸ | GRIN2D | O15399 | 1/20 | 0.50 |
| ▸ | GRIN2A | Q12879 | 1/20 | 0.50 |
| ▸ | GRIN2B | Q13224 | 1/20 | 0.50 |
| ▸ | GRIN2C | Q14957 | 1/20 | 0.50 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.50 |
| ▸ | CDC25B | P30305 | 2/20 | 0.49 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.48 |
| ▸ | CA12 | O43570 | 2/20 | 0.48 |
| ▸ | CA1 | P00915 | 2/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3391576 | 0.94 | HPGD (0.58) | HPGDHSD17B10MAPTTHRBTSHR | |
| SCHEMBL30991604 | 0.90 | KDM4E (0.53) | HPGDHSD17B10MAPTTHRBTSHR | |
| SCHEMBL27778819 | 0.90 | KDM4E (0.53) | HPGDHSD17B10MAPTTHRBTSHR | |
| SCHEMBL2188000 | 0.90 | CYP1A2 (0.52) | HPGDHSD17B10MAPTTHRBTSHR | |
| SCHEMBL9154691 | 0.88 | NR4A1 (0.53) | HPGDHSD17B10MAPTTHRBTSHR | |
| SCHEMBL3391137 | 0.86 | HPGD (0.58) | HPGDHSD17B10MAPTTHRBTSHR | |
| SCHEMBL28487844 | 0.82 | G6PD (0.46) | HPGDHSD17B10MAPTTHRBTSHR | |
| SCHEMBL29006242 | 0.80 | CYP1A2 (0.68) | HPGDHSD17B10MAPTTHRBTSHR | |
| SCHEMBL12486238 | 0.78 | HPGD (0.52) | HPGDHSD17B10MAPTTHRBTSHR | |
| SCHEMBL2407577 | 0.78 | HPGD (1.00) | HPGDHSD17B10MAPTTHRBTSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230296984-A1 | EUV RESIST UNDERLAYER FILM-FORMING COMPOSITION | NISSAN CHEMICAL CORPORATION (JP) | 2023-09-21 | — | — | US | disclosed |
| US-20230296984-A1 | EUV RESIST UNDERLAYER FILM-FORMING COMPOSITION | NISSAN CHEMICAL CORPORATION (JP) | 2023-09-21 | — | — | US | disclosed |
| EP-3230339-B1 | EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL | TORAY INDUSTRIES (JP) | 2022-03-23 | — | — | EP | disclosed |
| US-20210397090-A1 | RESIST UNDERLAYER FILM-FORMING COMPOSITION AND METHOD FOR FORMING RESIST PATTERN USING THE SAME | NISSAN CHEMICAL CORPORATION (JP) | 2021-12-23 | — | — | US | disclosed |
| CN-107001594-B | Composition epoxy resin, prepreg, the manufacturing method of fiber reinforced plastic materials and fiber reinforced plastic materials | 东丽株式会社 | 2019-07-23 | — | — | CN | disclosed |
| US-20170362376-A1 | EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL | TORAY INDUSTRIES, INC. (JP) | 2017-12-21 | — | — | US | disclosed |
| EP-3230339-A1 | EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL | Toray Industries, Inc. (JP) | 2017-10-18 | — | — | EP | disclosed |
| CN-107001594-A | Composition epoxy resin, prepreg, the manufacture method of fiber reinforced plastic materials and fiber reinforced plastic materials | 东丽株式会社 | 2017-08-01 | — | — | CN | disclosed |
| WO-2016087935-A1 | EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL | TORAY INDUSTRIES, INC. (JP) | 2016-06-09 | — | — | WO | disclosed |
| CN-102725273-B | Inclusion compound and manufacture method thereof | NIPPON SODA CO.,LTD. (JP) | 2016-02-17 | — | — | CN | disclosed |
| EP-2573148-A1 | CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME | Nippon Soda Co., Ltd. (JP) | 2013-03-27 | — | — | EP | disclosed |
| US-20130059942-A1 | CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME | NIPPON SODA CO., LTD. (JP) | 2013-03-07 | — | — | US | disclosed |
| CN-102892849-A | Curable powder coating composition and cured product thereof | NIPPON SODA CO | 2013-01-23 | — | — | CN | disclosed |
| CN-102725273-A | Clathrate and method for producing same | NIPPON SODA CO | 2012-10-10 | — | — | CN | disclosed |
| CN-101802049-B | Epoxy resin composition for semiconductor encapsulation containing inclusion complex | NIPPON SODA CO | 2012-09-12 | — | — | CN | disclosed |
| EP-2489689-A1 | COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF | Nippon Soda Co., Ltd. (JP) | 2012-08-22 | — | — | EP | disclosed |
| US-20120196991-A1 | COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF | NISSO CHEMICAL ANALYSIS SERVICE CO., LTD. (JP) | 2012-08-02 | — | — | US | disclosed |
| CN-101802049-A | Epoxy resin composition for semiconductor encapsulation containing inclusion complex | NIPPON SODA CO | 2010-08-11 | — | — | CN | disclosed |
| US-20100179250-A1 | INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | NIPPON SODA CO., LTD. (JP) | 2010-07-15 | — | — | US | disclosed |
| EP-2192139-A1 | INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | Nippon Soda Co., Ltd. (JP) | 2010-06-02 | — | — | EP | disclosed |