SCHEMBL3389763

SCHEMBL3389763

O=C(O)c1ccc2cccc(O)c2c1O

nearest known ligand 0.69

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.69
KMT2A Q03164 4/20 0.69
KDM4E B2RXH2 4/20 0.69
MEN1 O00255 3/20 0.69
HSD17B10 Q99714 3/20 0.69
TSHR P16473 1/20 0.69
RXFP1 Q9HBX9 1/20 0.69
LDHA P00338 1/20 0.56
SELL P14151 1/20 0.50
SELP P16109 1/20 0.50
DNMT1 P26358 1/20 0.50
CACNA1B Q00975 1/20 0.50
APBA1 Q02410 1/20 0.50
MCL1 Q07820 1/20 0.50
APOBEC3G Q9HC16 1/20 0.50
GRIN2D O15399 1/20 0.49
GRIN2A Q12879 1/20 0.49
GRIN2B Q13224 1/20 0.49
GRIN2C Q14957 1/20 0.49
CDK2 P24941 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5356059 0.83 ALDH1A1 (0.66) ALDH1A1KMT2AKDM4EMEN1HSD17B10
SCHEMBL8944544 0.83 KDM4E (0.53) ALDH1A1KMT2AKDM4EMEN1HSD17B10
SCHEMBL12800164 0.83 MAPT (0.49) ALDH1A1KMT2AKDM4EMEN1HSD17B10
SCHEMBL12486671 0.82 HSD17B10 (0.62) ALDH1A1KMT2AKDM4EMEN1HSD17B10
SCHEMBL689259 0.82 HSD17B10 (0.67) ALDH1A1KMT2AKDM4EMEN1HSD17B10
SCHEMBL29940636 0.82 HSD17B10 (0.67) ALDH1A1KMT2AKDM4EMEN1HSD17B10
SCHEMBL2788366 0.81 ALDH1A1 (0.65) ALDH1A1KMT2AKDM4EMEN1HSD17B10
SCHEMBL11388519 0.81 ALDH1A1 (0.65) ALDH1A1KMT2AKDM4EMEN1HSD17B10
2,3-Dihydroxybenzoic Acid SCHEMBL28182678 0.80 ALDH1A1 (0.61) ALDH1A1KMT2AKDM4EMEN1HSD17B10
SCHEMBL28860271 0.80 HSD17B10 (0.64) ALDH1A1KMT2AKDM4EMEN1HSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230296984-A1 EUV RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2023-09-21 US disclosed
US-20230296984-A1 EUV RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2023-09-21 US disclosed
US-11693313-B2 Resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2023-07-04 US disclosed
US-11693313-B2 Resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2023-07-04 US disclosed
US-20220179313-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2022-06-09 US disclosed
US-20220121118-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2022-04-21 US disclosed
EP-3230339-B1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES (JP) 2022-03-23 EP disclosed
US-20210397090-A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION AND METHOD FOR FORMING RESIST PATTERN USING THE SAME NISSAN CHEMICAL CORPORATION (JP) 2021-12-23 US disclosed
US-20210149302-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2021-05-20 US disclosed
US-20210149303-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2021-05-20 US disclosed
US-8653160-B2 Inclusion complex containing epoxy resin composition for semiconductor encapsulation NIPPON SODA CO., LTD. (JP) 2014-02-18 US disclosed
EP-2573148-A1 CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME Nippon Soda Co., Ltd. (JP) 2013-03-27 EP disclosed
US-20130059942-A1 CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME NIPPON SODA CO., LTD. (JP) 2013-03-07 US disclosed
CN-102725273-A Clathrate and method for producing same NIPPON SODA CO 2012-10-10 CN disclosed
CN-101802049-B Epoxy resin composition for semiconductor encapsulation containing inclusion complex NIPPON SODA CO 2012-09-12 CN disclosed
EP-2489689-A1 COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF Nippon Soda Co., Ltd. (JP) 2012-08-22 EP disclosed
US-20120196991-A1 COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF NISSO CHEMICAL ANALYSIS SERVICE CO., LTD. (JP) 2012-08-02 US disclosed
CN-101802049-A Epoxy resin composition for semiconductor encapsulation containing inclusion complex NIPPON SODA CO 2010-08-11 CN disclosed
US-20100179250-A1 INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION NIPPON SODA CO., LTD. (JP) 2010-07-15 US disclosed
EP-2192139-A1 INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION Nippon Soda Co., Ltd. (JP) 2010-06-02 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11693313-B2 Resist composition and method of forming resist pattern C1R, C1S, C9 ALDH1A1 1921/4885KMT2A 4179/4885KDM4E 4803/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.