SCHEMBL3389963

SCHEMBL3389963

CCC(CSSCC(CC)S(=O)(=O)O)S(=O)(=O)O

nearest known ligand 0.36

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
SLC22A6 Q4U2R8 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL329520 0.81
Hydrochloric Acid SCHEMBL28792672 0.78 TP53 (0.31)
SCHEMBL128775 0.78 TP53 (0.31)
SCHEMBL32689657 0.77
SCHEMBL1627316 0.77
SCHEMBL3392125 0.76 HDAC3 (0.31)
SCHEMBL14955502 0.76 TP53 (0.30)
SCHEMBL490947 0.74
SCHEMBL6632309 0.73 TP53 (0.30)
SCHEMBL3392076 0.73 FOLH1 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20100084277-A1 Composition for copper plating and associated methods SAMSUNG ELECTRONICS CO., LTD. (KR) 2010-04-08 US disclosed