SCHEMBL3391567

SCHEMBL3391567

CC(C)Cc1c(C(=O)O)cccc1C(=O)O

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.46
ALOX15 P16050 2/20 0.46
NR4A1 P22736 1/20 0.45
NR4A2 P43354 1/20 0.45
NR4A3 Q92570 1/20 0.45
KDM4E B2RXH2 2/20 0.44
HSD17B10 Q99714 2/20 0.44
HPGD P15428 1/20 0.44
MAPT P10636 1/20 0.43
HDAC8 Q9BY41 1/20 0.43
CXCR5 P32302 1/20 0.43
CA12 O43570 1/20 0.42
CA1 P00915 1/20 0.42
CA2 P00918 1/20 0.42
CA4 P22748 1/20 0.42
CA7 P43166 1/20 0.42
CA9 Q16790 1/20 0.42
FBP1 P09467 1/20 0.42
GABRA1 P14867 1/20 0.42
GABRB2 P47870 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3308510 0.89 CXCR5 (0.54) ALDH1A1ALOX15NR4A1KDM4EHSD17B10
SCHEMBL8735410 0.89 ALDH1A1 (0.48) ALDH1A1ALOX15KDM4EHSD17B10HPGD
SCHEMBL361119 0.89 GABRA1 (0.50) ALDH1A1ALOX15KDM4EHSD17B10HPGD
SCHEMBL14485075 0.87 GABRA1 (0.48) ALDH1A1ALOX15KDM4EHSD17B10HPGD
SCHEMBL7645921 0.87 TSHR (0.52) ALDH1A1KDM4EHSD17B10HPGDMAPT
SCHEMBL15592325 0.87 ALB (0.50) ALDH1A1ALOX15KDM4EHSD17B10HPGD
SCHEMBL1950367 0.87 CYP1A2 (0.44) ALDH1A1ALOX15KDM4EFBP1TSHR
SCHEMBL27736164 0.86 MAPT (0.47) ALDH1A1ALOX15NR4A1NR4A2NR4A3
SCHEMBL14829922 0.86 MAPT (0.40) ALDH1A1ALOX15KDM4EHSD17B10HPGD
SCHEMBL28134185 0.82 CA12 (0.43) ALDH1A1ALOX15NR4A1NR4A2NR4A3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106458883-A Chlorine resistant polyethylene compounds and articles made therefrom 弗纳技术股份有限公司 2017-02-22 CN claimed
CN-112479888-B Compound, polymer, patterning material, patterning method, and method for manufacturing semiconductor device 铠侠股份有限公司 2023-12-08 CN disclosed
EP-3230339-B1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES (JP) 2022-03-23 EP disclosed
CN-112479888-A Compound, polymer, pattern forming material, pattern forming method, and method for manufacturing semiconductor device 铠侠股份有限公司 2021-03-12 CN disclosed
CN-107827875-A A kind of application of benzimidazoles derivative as the inhibitor of Cyclin dependent kinase 4/6 文韬创新药物研究(北京)有限责任公司 2018-03-23 CN disclosed
CN-107793399-A CDK4/6 inhibitor and its preparation method and application 上海翰森生物医药科技有限公司 2018-03-13 CN disclosed
US-20170362376-A1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES, INC. (JP) 2017-12-21 US disclosed
CN-107266421-A Substituted benzimidazoles derivative 正大天晴药业集团股份有限公司 2017-10-20 CN disclosed
EP-3230339-A1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL Toray Industries, Inc. (JP) 2017-10-18 EP disclosed
CN-104955824-B It is used as the aminopyrimidine compounds of the inhibitor of the EGFR mutant containing T790M 豪夫迈·罗氏有限公司 2017-09-22 CN disclosed
US-20130059942-A1 CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME NIPPON SODA CO., LTD. (JP) 2013-03-07 US disclosed
EP-2489689-A1 COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF Nippon Soda Co., Ltd. (JP) 2012-08-22 EP disclosed
US-20120196991-A1 COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF NISSO CHEMICAL ANALYSIS SERVICE CO., LTD. (JP) 2012-08-02 US disclosed
US-20100179250-A1 INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION NIPPON SODA CO., LTD. (JP) 2010-07-15 US disclosed
EP-2192139-A1 INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION Nippon Soda Co., Ltd. (JP) 2010-06-02 EP disclosed
WO-2009136001-A1 PROTEIN KINASE MODULATING AGENTS TUOMINEN RAIMO (FI) 2009-11-12 WO disclosed
US-20080227946-A1 Thermosetting Composition and Curing Method Thereof SHOWA DENKO K.K. 2008-09-18 US disclosed
EP-1732980-A1 THERMOSETTING COMPOSITION AND CURING METHOD THEREOF SHOWA DENKO KABUSHIKI KAISHA (JP) 2006-12-20 EP disclosed
CN-1784231-A 1-amino 1H-imidazoquinolines 3M INNOVATIVE PROPERTIES CO (US) 2006-06-07 CN disclosed
WO-2005097882-A1 THERMOSETTING COMPOSITION AND CURING METHOD THEREOF SHOWA DENKO K.K. (JP) 2005-10-20 WO disclosed